SCHEMBL170323

SCHEMBL170323

CCC(CC)(OC)[PH](=O)O

nearest known ligand 0.33

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33
TSHR P16473 1/20 0.33
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylamine SCHEMBL11035148 0.69
SCHEMBL756079 0.67
Methane SCHEMBL9786805 0.67
SCHEMBL686400 0.65
Butane SCHEMBL712996 0.65
SCHEMBL1023552 0.65 ALDH1A1 (0.31) ALDH1A1TSHRTDP1
SCHEMBL5547565 0.63
Propionamide SCHEMBL28844304 0.63 ALOX15 (0.36) ALDH1A1TDP1
Ethylenediamine SCHEMBL11896990 0.63
Ethylenediamine SCHEMBL28429183 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8148643-B2 Multilayered printed circuit board and manufacturing method thereof IBIDEN CO., LTD. (JP) 2012-04-03 US disclosed
EP-1843650-B1 Method of manufacturing a multilayered printed circuit board IBIDEN CO LTD (JP) 2012-03-07 EP disclosed
US-7832098-B2 Method of manufacturing a multilayered printed circuit board IBIDEN CO., LTD. (JP) 2010-11-16 US disclosed
US-7415761-B2 Method of manufacturing multilayered circuit board IBIDEN CO., LTD. (JP) 2008-08-26 US disclosed
US-20080189943-A1 MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF IBIDEN CO., LTD. (JP) 2008-08-14 US disclosed
US-20080173473-A1 MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF IBIDEN CO., LTD (JP) 2008-07-24 US disclosed