SCHEMBL1703497

SCHEMBL1703497

Cc1ccccc1S(=O)(=O)[O-].c1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.37
LMNA P02545 1/20 0.37
ALDH1A1 P00352 4/20 0.37
HSD11B1 P28845 1/20 0.36
KMT2A Q03164 2/20 0.36
MEN1 O00255 1/20 0.36
ESR1 P03372 1/20 0.36
GAA P10253 1/20 0.36
ESR2 Q92731 1/20 0.36
CTSG P08311 1/20 0.36
CMA1 P23946 1/20 0.36
SLC1A3 P43003 1/20 0.36
SLC1A2 P43004 1/20 0.36
SLC1A1 P43005 1/20 0.36
RAPGEF4 Q8WZA2 1/20 0.35
KDM4E B2RXH2 3/20 0.35
POLB P06746 2/20 0.35
CYP2C9 P11712 2/20 0.35
CYP3A4 P08684 1/20 0.35
L3MBTL1 Q9Y468 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3151887 0.91 ESR1 (0.38) ALDH1A1HSD11B1KMT2AMEN1ESR1
SCHEMBL9615639 0.89 HSD11B1 (0.41) TDP1LMNAALDH1A1HSD11B1KDM4E
SCHEMBL4456490 0.87 TDP1 (0.36) TDP1LMNAALDH1A1HSD11B1KMT2A
SCHEMBL7805745 0.87 TDP1 (0.36) TDP1LMNAALDH1A1HSD11B1KMT2A
SCHEMBL2512390 0.86 FFAR4 (0.36) TDP1LMNAALDH1A1KMT2AMEN1
SCHEMBL5399285 0.84 HSD11B1 (0.42) TDP1LMNAALDH1A1HSD11B1KMT2A
SCHEMBL16034284 0.84 TDP1 (0.45) TDP1LMNAALDH1A1HSD11B1KMT2A
SCHEMBL6915057 0.84 HSD11B1 (0.42) TDP1LMNAALDH1A1HSD11B1KMT2A
SCHEMBL20658918 0.84 HSD11B1 (0.42) TDP1LMNAALDH1A1HSD11B1KMT2A
SCHEMBL20533883 0.84 HSD11B1 (0.42) TDP1LMNAALDH1A1HSD11B1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1093645-C Photoresist material and method for producing semiconductor constituted of corrosion resist picture thereof NEC CORP (JP) 2002-10-30 CN claimed
US-6096478-A Resist material for forming a chemically amplified negative type resist pattern and method of manufacturing a semiconductor device employing the resist pattern NEC CORPORATION (JP) 2000-08-01 US claimed
CN-1227355-A Photoresist material and method for producing semiconductor constituted of corrosion resist picture thereof NEC CORP (JP) 1999-09-01 CN claimed
US-4108747-A Curable compositions and method for curing such compositions GENERAL ELECTRIC COMPANY (US) 1978-08-22 US claimed
WO-2023002928-A1 FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE 株式会社ADEKA 2023-01-26 WO disclosed
EP-2000851-B1 Photomask blank, resist pattern forming process, and photomask preparation process SHINETSU CHEMICAL CO (JP) 2015-07-29 EP disclosed
US-8343694-B2 Photomask blank, resist pattern forming process, and photomask preparation process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-01-01 US disclosed
EP-1684118-B1 Patterning process using a negative resist composition SHINETSU CHEMICAL CO (JP) 2012-04-18 EP disclosed
US-20080305411-A1 PHOTOMASK BLANK, RESIST PATTERN FORMING PROCESS, AND PHOTOMASK PREPARATION PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-12-11 US disclosed
EP-2000851-A1 Photomask blank, resist pattern forming process, and photomask preparation process Shin-Etsu Chemical Co., Ltd. (JP) 2008-12-10 EP disclosed
US-7335787-B2 Method for producing onium salt derivatives, and novel onium salt derivatives TOYO GOSEI KOGYO CO., LTD. (JP) 2008-02-26 US disclosed
US-7312016-B2 Chemically amplified positive resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-12-25 US disclosed
US-20020058201-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-05-16 US disclosed
EP-1164127-A1 PROCESS FOR PRODUCING ONIUM SALT DERIVATIVE AND NOVEL ONIUM SALT DERIVATIVE Toyo Gosei Kogyo Co., Ltd. (JP) 2001-12-19 EP disclosed
US-6096478-A Resist material for forming a chemically amplified negative type resist pattern and method of manufacturing a semiconductor device employing the resist pattern NEC CORPORATION (JP) 2000-08-01 US disclosed
US-6010820-A COMPOUND CAPABLE OF GENERTING SULFONIC ACID UPON IRRADIATION FUJI PHOTO FILM CO., LTD. (JP) 2000-01-04 US disclosed
CN-1227355-A Photoresist material and method for producing semiconductor constituted of corrosion resist picture thereof NEC CORP (JP) 1999-09-01 CN disclosed
US-5945250-A CONTAINING A SULFONIUM SALT RESIN; HAVING GOOD SOLUBILITY IN SOLVENT, HIGH PHOTOSENSITIVITY, EXCELLENT RESIST PATTERN AND STABILITY FUJI PHOTO FILM CO., LTD. (JP) 1999-08-31 US disclosed
US-5925484-A Black photosensitive resin composition, color filter made by using the same, and a process for the production thereof TOPPAN PRINTING CO., LTD. (JP) 1999-07-20 US disclosed
US-4108747-A Curable compositions and method for curing such compositions GENERAL ELECTRIC COMPANY (US) 1978-08-22 US disclosed