SCHEMBL4456490

SCHEMBL4456490

C[S+](c1ccccc1)c1ccccc1.Cc1ccccc1S(=O)(=O)[O-]

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.36
LMNA P02545 1/20 0.36
HSD11B1 P28845 1/20 0.36
KMT2A Q03164 2/20 0.35
MEN1 O00255 1/20 0.35
ESR1 P03372 1/20 0.35
GAA P10253 1/20 0.35
ESR2 Q92731 1/20 0.35
CTSG P08311 1/20 0.35
CMA1 P23946 1/20 0.35
SLC1A3 P43003 1/20 0.35
SLC1A2 P43004 1/20 0.35
SLC1A1 P43005 1/20 0.35
RAPGEF4 Q8WZA2 1/20 0.34
KDM4E B2RXH2 3/20 0.34
CYP2C9 P11712 2/20 0.34
POLB P06746 1/20 0.34
CYP3A4 P08684 1/20 0.34
ALDH1A1 P00352 5/20 0.33
L3MBTL1 Q9Y468 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7805745 0.89 TDP1 (0.36) TDP1LMNAHSD11B1KMT2AMEN1
SCHEMBL1703497 0.87 TDP1 (0.37) TDP1LMNAHSD11B1KMT2AMEN1
SCHEMBL2279336 0.87 HSD11B1 (0.42) TDP1LMNAHSD11B1KMT2AMEN1
Water SCHEMBL11621677 0.85 HSD11B1 (0.41) TDP1LMNAHSD11B1KMT2AMEN1
SCHEMBL5399285 0.82 HSD11B1 (0.42) TDP1LMNAHSD11B1KMT2AMEN1
SCHEMBL57931 0.82 TDP1 (0.45) TDP1LMNAHSD11B1KMT2AMEN1
SCHEMBL20533883 0.82 HSD11B1 (0.42) TDP1LMNAHSD11B1KMT2AMEN1
SCHEMBL20658918 0.82 HSD11B1 (0.42) TDP1LMNAHSD11B1KMT2AMEN1
SCHEMBL16034284 0.82 TDP1 (0.45) TDP1LMNAHSD11B1KMT2AMEN1
SCHEMBL6915627 0.82 HSD11B1 (0.42) TDP1LMNAHSD11B1KMT2AMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2469337-B1 Positive photosensitive resin composition, method for forming pattern, and electronic component HITACHI CHEM DUPONT MICROSYS (JP) 2014-01-22 EP claimed
EP-2469337-A1 Positive photosensitive resin composition, method for forming pattern, and electronic component Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2012-06-27 EP claimed
EP-1744213-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT HITACHI CHEM DUPONT MICROSYS (JP) 2014-09-03 EP disclosed
EP-2469337-B1 Positive photosensitive resin composition, method for forming pattern, and electronic component HITACHI CHEM DUPONT MICROSYS (JP) 2014-01-22 EP disclosed
EP-2469337-A1 Positive photosensitive resin composition, method for forming pattern, and electronic component Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2012-06-27 EP disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
EP-1744213-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical DuPont Microsystems Ltd. (JP) 2007-01-17 EP disclosed