⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15465889 | 0.79 | OAT (0.41) | — | |
| SCHEMBL17756281 | 0.75 | — | — | |
| SCHEMBL17756014 | 0.72 | CES2 (0.36) | — | |
| SCHEMBL14243692 | 0.72 | MME (0.35) | — | |
| SCHEMBL17146782 | 0.72 | MME (0.35) | — | |
| SCHEMBL14243589 | 0.72 | CES2 (0.36) | — | |
| SCHEMBL19396663 | 0.71 | — | — | |
| SCHEMBL14244032 | 0.69 | — | — | |
| SCHEMBL17146838 | 0.69 | — | — | |
| SCHEMBL57284 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3398975-B1 | PHOTOSENSITIVE COMPOSITION | SAN APRO LTD (JP) | 2023-02-01 | — | — | EP | disclosed |
| CN-105467765-B | Photosensitive composition, method for producing cured film, and use thereof | 富士胶片株式会社 | 2020-04-24 | — | — | CN | disclosed |
| US-20180373145-A1 | PHOTOSENSITIVE COMPOSITION | SAN-APRO LTD. (JP) | 2018-12-27 | — | — | US | disclosed |
| EP-3398975-A1 | PHOTOSENSITIVE COMPOSITION | San-Apro Limited (JP) | 2018-11-07 | — | — | EP | disclosed |
| US-9966295-B2 | Temporary bonding laminates for use in manufacture of semiconductor devices and method for manufacturing semiconductor devices | FUJIFILM CORPORATION (JP) | 2018-05-08 | — | — | US | disclosed |
| US-9716025-B2 | Temporary bonding laminates for use in manufacture of semiconductor devices | FUJIFILM CORPORATION (JP) | 2017-07-25 | — | — | US | disclosed |
| US-9716024-B2 | Temporary bonding laminates for used in manufacture of semiconductor devices | FUJIFILM CORPORATION (JP) | 2017-07-25 | — | — | US | disclosed |
| US-20170012022-A1 | PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2017-01-12 | — | — | US | disclosed |
| US-20160104635-A1 | TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES | FUJIFILM CORPORATION (JP) | 2016-04-14 | — | — | US | disclosed |
| US-20160035612-A1 | TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES | FUJIFILM CORPORATION (JP) | 2016-02-04 | — | — | US | disclosed |
| US-20160013088-A1 | TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES | FUJIFILM CORPORATION (JP) | 2016-01-14 | — | — | US | disclosed |
| US-8853290-B2 | Photosensitive composition | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2014-10-07 | — | — | US | disclosed |
| US-20120142806-A1 | PHOTOSENSITIVE COMPOSITION | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2012-06-07 | — | — | US | disclosed |
| EP-2441778-A1 | PHOTOSENSITIVE COMPOSITION | Sanyo Chemical Industries, Ltd. (JP) | 2012-04-18 | — | — | EP | disclosed |