Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.44 |
| ▸ | CES2 | O00748 | 3/20 | 0.43 |
| ▸ | CES1 | P23141 | 3/20 | 0.43 |
| ▸ | POLB | P06746 | 1/20 | 0.40 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.39 |
| ▸ | ACP1 | P24666 | 1/20 | 0.39 |
| ▸ | CDC25B | P30305 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.36 |
| ▸ | CNR1 | P21554 | 1/20 | 0.36 |
| ▸ | CNR2 | P34972 | 1/20 | 0.36 |
| ▸ | PTGES | O14684 | 2/20 | 0.35 |
| ▸ | ALOX5 | P09917 | 2/20 | 0.35 |
| ▸ | RARB | P10826 | 3/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17069979 | 0.96 | CES2 (0.46) | SMN1; SMN2CES2CES1PTPN1ACP1 | |
| SCHEMBL28941349 | 0.95 | CES2 (0.45) | SMN1; SMN2CES2CES1POLBALDH1A1 | |
| SCHEMBL92006 | 0.92 | CES2 (0.48) | SMN1; SMN2CES2CES1PTPN1ACP1 | |
| SCHEMBL22729193 | 0.92 | CES2 (0.48) | SMN1; SMN2CES2CES1PTPN1ACP1 | |
| SCHEMBL103376 | 0.92 | CES2 (0.48) | SMN1; SMN2CES2CES1PTPN1ACP1 | |
| SCHEMBL12021972 | 0.92 | CES2 (0.48) | SMN1; SMN2CES2CES1PTPN1ACP1 | |
| SCHEMBL123398 | 0.92 | CES2 (0.48) | SMN1; SMN2CES2CES1PTPN1ACP1 | |
| SCHEMBL149909 | 0.91 | CES2 (0.47) | SMN1; SMN2CES2CES1ALDH1A1HPGD | |
| SCHEMBL13009339 | 0.91 | CES2 (0.47) | SMN1; SMN2CES2CES1ALDH1A1HPGD | |
| SCHEMBL149908 | 0.91 | CES2 (0.47) | SMN1; SMN2CES2CES1ALDH1A1HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9683150-B2 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-06-20 | — | — | US | disclosed |
| US-9683150-B2 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-06-20 | — | — | US | disclosed |
| US-20170115563-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-04-27 | — | — | US | disclosed |
| US-20170115563-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-04-27 | — | — | US | disclosed |
| EP-2930200-B1 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO LTD (JP) | 2016-07-20 | — | — | EP | disclosed |
| WO-2015198887-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | 東京応化工業株式会社 | 2015-12-30 | — | — | WO | disclosed |
| EP-2930200-A1 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-10-14 | — | — | EP | disclosed |
| US-20150252229-A1 | CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-09-10 | — | — | US | disclosed |
| US-20150252229-A1 | CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-09-10 | — | — | US | disclosed |