Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 2/20 | 0.37 |
| ▸ | NPC1 | O15118 | 4/20 | 0.37 |
| ▸ | RAB9A | P51151 | 4/20 | 0.37 |
| ▸ | PKM | P14618 | 3/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.37 |
| ▸ | MAPT | P10636 | 2/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.37 |
| ▸ | HPGD | P15428 | 1/20 | 0.37 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | MGLL | Q99685 | 1/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
| ▸ | GAA | P10253 | 1/20 | 0.36 |
| ▸ | CDK5 | Q00535 | 3/20 | 0.36 |
| ▸ | CDK5R1 | Q15078 | 3/20 | 0.36 |
| ▸ | MITF | O75030 | 1/20 | 0.36 |
| ▸ | CHEK2 | O96017 | 1/20 | 0.35 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.35 |
| ▸ | TNF | P01375 | 1/20 | 0.35 |
| ▸ | KLF5 | Q13887 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17644162 | 1.00 | POLB (0.37) | POLBNPC1RAB9APKMSMN1; SMN2 | |
| SCHEMBL15960798 | 1.00 | POLB (0.37) | POLBNPC1RAB9APKMSMN1; SMN2 | |
| SCHEMBL17069998 | 0.99 | POLB (0.39) | POLBNPC1RAB9APKMSMN1; SMN2 | |
| SCHEMBL31621087 | 0.99 | POLB (0.39) | POLBNPC1RAB9APKMSMN1; SMN2 | |
| SCHEMBL17540445 | 0.99 | POLB (0.39) | POLBNPC1RAB9APKMSMN1; SMN2 | |
| SCHEMBL17540446 | 0.95 | NPC1 (0.39) | POLBNPC1RAB9APKMSMN1; SMN2 | |
| SCHEMBL20015387 | 0.89 | CYSLTR2 (0.34) | POLBALDH1A1L3MBTL1LMNACHEK2 | |
| SCHEMBL25373230 | 0.89 | L3MBTL1 (0.44) | NPC1RAB9APKMSMN1; SMN2MAPT | |
| SCHEMBL17070001 | 0.89 | L3MBTL1 (0.44) | NPC1RAB9APKMSMN1; SMN2MAPT | |
| SCHEMBL19795438 | 0.89 | L3MBTL1 (0.44) | NPC1RAB9APKMSMN1; SMN2MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| US-11809079-B2 | Photosensitive resin composition, polyimide production method, and semiconductor device | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-11-07 | — | — | US | disclosed |
| US-20230331922-A1 | COMPOSITION, LIGHT SHIELDING FILM, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND METHOD FOR MANUFACTURING CURED FILM | FUJIFILM CORPORATION (JP) | 2023-10-19 | — | — | US | disclosed |
| US-20230221639-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-07-13 | — | — | US | disclosed |
| US-20230221639-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-07-13 | — | — | US | disclosed |
| US-11640112-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-05-02 | — | — | US | disclosed |
| US-11640112-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-05-02 | — | — | US | disclosed |
| US-20220276555-A1 | Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component | HD MICROSYSTEMS, LTD. (JP) | 2022-09-01 | — | — | US | disclosed |
| US-20220269170-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2022-08-25 | — | — | US | disclosed |
| WO-2017170600-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | 旭化成株式会社 | 2017-10-05 | — | — | WO | disclosed |
| US-9683150-B2 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-06-20 | — | — | US | disclosed |
| US-9683150-B2 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-06-20 | — | — | US | disclosed |
| US-20170115563-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-04-27 | — | — | US | disclosed |
| US-20170115563-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-04-27 | — | — | US | disclosed |
| EP-2930200-B1 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO LTD (JP) | 2016-07-20 | — | — | EP | disclosed |
| WO-2015198887-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | 東京応化工業株式会社 | 2015-12-30 | — | — | WO | disclosed |
| EP-2930200-A1 | Curable composition, adhesive, method of producing fiber-reinforced composite material, and fiber-reinforced composite material | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-10-14 | — | — | EP | disclosed |
| US-20150252229-A1 | CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-09-10 | — | — | US | disclosed |
| US-20150252229-A1 | CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-09-10 | — | — | US | disclosed |