SCHEMBL1714372

SCHEMBL1714372

CCCCCCCCCCCCc1ccccc1S([O])(=O)=O

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LIPG Q9Y5X9 1/20 0.51
NR1H2 P55055 1/20 0.46
NR1H3 Q13133 1/20 0.46
BID P55957 3/20 0.44
MCL1 Q07820 3/20 0.44
BCL2L1 Q07817 2/20 0.44
BAK1 Q16611 2/20 0.44
KAT8 Q9H7Z6 2/20 0.44
PPARA Q07869 2/20 0.44
PPARG P37231 1/20 0.44
EP300 Q09472 1/20 0.44
KAT2A Q92830 1/20 0.44
KAT2B Q92831 1/20 0.44
KAT5 Q92993 1/20 0.44
SAE1 Q9UBE0 1/20 0.44
THRA P10827 1/20 0.43
THRB P10828 1/20 0.43
RECQL P46063 1/20 0.43
CYSLTR2 Q9NS75 4/20 0.42
CYSLTR1 Q9Y271 4/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8932920 0.93 LIPG (0.42) LIPGNR1H2NR1H3RECQLELANE
SCHEMBL8520962 0.87 LIPG (0.53) LIPGNR1H2NR1H3BIDMCL1
SCHEMBL28303872 0.86 LIPG (0.51) LIPGNR1H2NR1H3BIDMCL1
SCHEMBL330570 0.85 CTSB (0.41) PPARAPPARGRECQLELANECTSG
SCHEMBL1403975 0.84 LIPG (0.50) LIPGNR1H2NR1H3BIDMCL1
SCHEMBL11469686 0.84 LIPG (0.50) LIPGNR1H2NR1H3BIDMCL1
SCHEMBL6535928 0.84 LIPG (0.54) LIPGNR1H2NR1H3BIDMCL1
SCHEMBL579137 0.84 LIPG (0.50) LIPGNR1H2NR1H3BIDMCL1
SCHEMBL21121138 0.84 LIPG (0.54) LIPGNR1H2NR1H3BIDMCL1
SCHEMBL1403964 0.84 LIPG (0.50) LIPGNR1H2NR1H3BIDMCL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230176479-A1 NEGATIVE RESIST FILM LAMINATE AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-06-08 US disclosed
EP-4167028-A1 NEGATIVE RESIST FILM LAMINATE AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-04-19 EP disclosed
CN-115885217-A Negative resist film laminate and pattern forming method 信越化学工业株式会社 2023-03-31 CN disclosed
CN-108107676-B Chemically amplified positive resist film laminate and pattern formation method 信越化学工业株式会社 2023-02-21 CN disclosed
CN-108459469-B Pattern forming method 信越化学工业株式会社 2022-11-11 CN disclosed
US-11460774-B2 Photosensitive resin composition, photosensitive dry film, and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-10-04 US disclosed
CN-114600045-A Photosensitive resin composition, photosensitive dry film and pattern forming method 信越化学工业株式会社 2022-06-07 CN disclosed
US-11256174-B2 Pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-02-22 US disclosed
EP-3671345-B1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS SHINETSU CHEMICAL CO (JP) 2022-02-02 EP disclosed
WO-2021079679-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD 信越化学工業株式会社 2021-04-29 WO disclosed
US-20180143535-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST FILM LAMINATE AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-24 US disclosed
EP-2757135-B1 Method of bonding parts to a vehicle by an acrylic foam tape 3M INNOVATIVE PROPERTIES CO (US) 2017-11-29 EP disclosed
EP-2757135-A1 Method of bonding parts to a vehicle by an acrylic foam tape 3M Innovative Properties Company (US) 2014-07-23 EP disclosed
EP-1476452-B1 ACYL- AND BISACYLPHOSPHINE DERIVATIVES BASF SE (DE) 2011-07-20 EP disclosed
US-7511084-B2 Acyl- and bisacylphosphine derivatives BASF AKTIENGESELLSCHAFT (DE) 2009-03-31 US disclosed
US-20050222294-A1 Acyl- and bisacylphosphine derivatives IGM GROUP B.V. (NL) 2005-10-06 US disclosed
EP-0693697-B1 A method for producing retroreflective sheeting NIPPON CARBIDE KOGYO KK (JP) 2003-02-19 EP disclosed
EP-0889105-A2 Kit of parts comprising a pressure-sensitive adhesive tape and a primer MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1999-01-07 EP disclosed
US-5824390-A EMBEDDED GLASS BEADS, THERMOPLASTIC RESIN, COUPLING AGENT NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 1998-10-20 US disclosed
EP-0693697-A2 A method for producing retroreflective sheeting NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 1996-01-24 EP disclosed