SCHEMBL1715067

SCHEMBL1715067

CCCCC(CC(=O)OCC1CO1)C(=O)OCC1CO1

nearest known ligand 0.50

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.43
SMN1; SMN2 Q16637 1/20 0.40
CA1 P00915 1/20 0.39
CA2 P00918 1/20 0.39
TDP1 Q9NUW8 1/20 0.38
TP53 P04637 1/20 0.37
CYP3A4 P08684 1/20 0.37
TLR4 O00206 1/20 0.36
MGLL Q99685 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL28201965 0.99 ALDH1A1 (0.42) ALDH1A1SMN1; SMN2CA1CA2TDP1
SCHEMBL29049547 0.94 ALDH1A1 (0.43) ALDH1A1SMN1; SMN2TDP1TLR4
SCHEMBL28197584 0.90 CA2 (0.45) ALDH1A1SMN1; SMN2CA1CA2TLR4
Water SCHEMBL28201966 0.89 CA2 (0.44) ALDH1A1SMN1; SMN2CA1CA2TLR4
SCHEMBL93242 0.86 CA2 (0.54) ALDH1A1SMN1; SMN2CA1CA2TDP1
SCHEMBL6912216 0.85 ALDH1A1 (0.47) ALDH1A1SMN1; SMN2CA1CA2TDP1
SCHEMBL21318433 0.85 ALDH1A1 (0.47) ALDH1A1SMN1; SMN2CA1CA2TDP1
SCHEMBL20760836 0.84 ALDH1A1 (0.45) ALDH1A1TP53CYP3A4MGLL
SCHEMBL729485 0.84 ALDH1A1 (0.46) ALDH1A1TP53CYP3A4MGLL
SCHEMBL9960265 0.84 ALDH1A1 (0.44) ALDH1A1SMN1; SMN2TDP1TP53CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023071921-A1 POLYAMIDE COMPOSITE MATERIAL, AND PREPARATION METHOD THEREFOR AND USE THEREOF 上海金发科技发展有限公司 2023-05-04 WO claimed
CN-109679284-A Imidazole modified high-strength temperature-resistant composition epoxy resin of silicon substrate and preparation method thereof 漳州丽都化工有限公司 2019-04-26 CN claimed
CN-108546536-A A kind of OLED frames encapsulation Wear Characteristics of Epoxy Adhesive mixture and preparation method thereof 深圳飞世尔新材料股份有限公司 2018-09-18 CN claimed
CN-107541018-A A kind of aramid fiber cellular composite material enhancing impregnating resin and application thereof 四川力通复合材料科技有限公司 2018-01-05 CN claimed
CN-105331186-B A kind of heat resistance solder mask 重庆智菱油墨科技有限公司 2017-12-19 CN claimed
CN-105342095-B A kind of special label release ornament of smelting furnace workman 郭婉娜 2017-08-25 CN claimed
CN-110358463-A A kind of lacquer painting protective film of high-fracture toughness and its application 宁波激智科技股份有限公司 2019-10-22 CN disclosed
CN-108587060-A A kind of benzoxazine colophony constituent and its prepreg suitable for microwave curing process 江苏恒神股份有限公司 2018-09-28 CN disclosed
CN-108546536-A A kind of OLED frames encapsulation Wear Characteristics of Epoxy Adhesive mixture and preparation method thereof 深圳飞世尔新材料股份有限公司 2018-09-18 CN disclosed
CN-108264733-A External decoration moulding solvent-free epoxy resin composition and external decoration formative method 北京纽维逊建筑工程技术有限公司 2018-07-10 CN disclosed
CN-108250396-A A kind of environment protection type high-strength shock resistance moulding compound and preparation method thereof 浙江四达新材料股份有限公司 2018-07-06 CN disclosed
CN-108250944-A Concrete protective coating system and construction method 中冶建筑研究总院有限公司 2018-07-06 CN disclosed
CN-107641490-A A kind of epoxy adhesive 北京天山新材料技术有限公司 2018-01-30 CN disclosed
EP-1876495-B1 COMPOSITION COMPRISING POLYMER HAVING ETHYLENE-DICARBONYL STRUCTURE FOR USE IN FORMING ANTI-REFLECTIVE COATING FOR LITHOGRAPHY NISSAN CHEMICAL IND LTD (JP) 2011-07-20 EP disclosed
US-7842620-B2 Method for manufacturing semiconductor device using quadruple-layer laminate NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-11-30 US disclosed
US-20100022089-A1 Method for manufacturing semiconductor device using quadruple-layer laminate NISSIAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-01-28 US disclosed
US-7632626-B2 a polyester copolymer of fumaric acid and a diglycidyl ether with backbone of groups selected from substituted or unsubstituted alkylene, phenylene, napthylene, anthrylene, phthalic acid, triazinetrione etc. 1,3,4,6-tetrakis(methtoxymethyl)glycoluril crosslinker, a sulfonium or iodonium acid generator NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2009-12-15 US disclosed
EP-2085823-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING QUADRUPLE-LAYER LAMINATE Nissan Chemical Industries, Ltd. (JP) 2009-08-05 EP disclosed
US-20080268379-A1 a polyester copolymer of fumaric acid and a diglycidyl ether with backbone of groups selected from substituted or unsubstituted alkylene, phenylene, napthylene, anthrylene, phthalic acid, triazinetrione etc. 1,3,4,6-tetrakis(methtoxymethyl)glycoluril crosslinker, a sulfonium or iodonium acid generator NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2008-10-30 US disclosed
EP-1876495-A1 COMPOSITION COMPRISING POLYMER HAVING ETHYLENE-DICARBONYL STRUCTURE FOR USE IN FORMING ANTI-REFLECTIVE COATING FOR LITHOGRAPHY Nissan Chemical Industries, Ltd. (JP) 2008-01-09 EP disclosed