⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18412654 | 1.00 | — | — | |
| SCHEMBL21040066 | 1.00 | — | — | |
| Water SCHEMBL1741352 | 0.97 | — | — | |
| SCHEMBL13492691 | 0.89 | KDM4E (0.38) | — | |
| SCHEMBL19672397 | 0.86 | KISS1R (0.45) | — | |
| SCHEMBL2246543 | 0.83 | — | — | |
| SCHEMBL4455933 | 0.79 | — | — | |
| SCHEMBL18661328 | 0.79 | — | — | |
| SCHEMBL18508448 | 0.79 | — | — | |
| SCHEMBL12807537 | 0.78 | ALOX15 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 390 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12325844-B2 | Photoresist remover | VERSUM MATERIALS US, LLC (US) | 2025-06-10 | — | — | US | claimed |
| CN-118223024-A | Etching solution for copper thick film | 松下知识产权经营株式会社 | 2024-06-21 | — | — | CN | claimed |
| CN-112859552-B | Application of vanadium oxide corrosion inhibition fluorine-containing stripping liquid | 上海新阳半导体材料股份有限公司 | 2024-01-05 | — | — | CN | claimed |
| CN-112859553-B | Vanadium oxide corrosion inhibition fluorine-containing stripping solution | 上海新阳半导体材料股份有限公司 | 2023-11-10 | — | — | CN | claimed |
| CN-112859554-B | Preparation method of vanadium oxide corrosion inhibition fluorine-containing stripping liquid | 上海新阳半导体材料股份有限公司 | 2023-11-10 | — | — | CN | claimed |
| CN-110361941-B | Positive photoresist stripping liquid, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-02-03 | — | — | CN | claimed |
| US-20220333044-A1 | Photoresist Remover | VERSUM MATERIALS US, LLC (US) | 2022-10-20 | — | — | US | claimed |
| EP-3037511-B1 | SEMI-AQUEOUS PHOTORESIST OR SEMICONDUCTOR MANUFACTURING RESIDUE STRIPPING AND CLEANING COMPOSITION WITH IMPROVED SILICON PASSIVATION | VERSUM MAT US LLC (US) | 2022-07-06 | — | — | EP | claimed |
| CN-114502708-A | Photoresist remover | 弗萨姆材料美国有限责任公司 | 2022-05-13 | — | — | CN | claimed |
| CN-112859553-A | Vanadium oxide corrosion-inhibition fluorine-containing stripping liquid, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-05-28 | — | — | CN | claimed |
| US-20110165811-A1 | Article Formed From Electrospinning A Dispersion | DOW CORNING CORPORATION (US) | 2011-07-07 | — | — | US | claimed |
| US-7968507-B2 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-06-28 | — | — | US | claimed |
| EP-2318575-A2 | ARTICLE FORMED FROM ELECTROSPINNING A DISPERSION | Dow Corning Corporation (US) | 2011-05-11 | — | — | EP | claimed |
| WO-2010025381-A2 | ARTICLE FORMED FROM ELECTROSPINNING A DISPERSION | DOW CORNING CORPORATION (US) | 2010-03-04 | — | — | WO | claimed |
| US-20090084406-A1 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. | 2009-04-02 | — | — | US | claimed |
| EP-1117471-B1 | COMPOSITION AND PROCESS FOR REMOVAL OF ACID GASES | INEOS LLC (US) | 2003-02-05 | — | — | EP | claimed |
| CN-1324264-A | Composition and process for removal of acid gases | DOW CHEMICAL CO (US) | 2001-11-28 | — | — | CN | claimed |
| EP-1117471-A1 | COMPOSITION AND PROCESS FOR REMOVAL OF ACID GASES | THE DOW CHEMICAL COMPANY (US) | 2001-07-25 | — | — | EP | claimed |
| US-6207121-B1 | PURIFICATION OF FLUID STREAMS BY ABSORPTION OF ACID GAS BY AN AQUEOUS MIXTURE OF A TERTIARY-ALKANOLAMINE AND 2-HYDROXY-BUTYLAMINE OR AN N-SUBSTITUTED 2-HYDROXYBUTYLAMINE; STABILITY; REGENERATION | THE DOW CHEMICAL COMPANY | 2001-03-27 | — | — | US | claimed |
| WO-2000018493-A1 | COMPOSITION AND PROCESS FOR REMOVAL OF ACID GASES | THE DOW CHEMICAL COMPANY (US) | 2000-04-06 | — | — | WO | claimed |