⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15294523 | 0.87 | — | — | |
| SCHEMBL12254936 | 0.79 | F2R (0.30) | — | |
| SCHEMBL14132806 | 0.75 | — | — | |
| SCHEMBL10305799 | 0.75 | — | — | |
| SCHEMBL13564269 | 0.75 | — | — | |
| SCHEMBL13266294 | 0.75 | — | — | |
| SCHEMBL12415001 | 0.75 | — | — | |
| SCHEMBL15684577 | 0.75 | — | — | |
| SCHEMBL22399918 | 0.75 | — | — | |
| SCHEMBL415325 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20180181003-A1 | PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND LAMINATE | FUJIFILM CORPORATION (JP) | 2018-06-28 | — | — | US | disclosed |
| EP-2143711-B1 | Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using same | FUJIFILM CORP (JP) | 2016-12-21 | — | — | EP | disclosed |
| EP-1489459-B1 | Positive resist composition and method of forming pattern using the same | FUJIFILM CORP (JP) | 2015-10-14 | — | — | EP | disclosed |
| US-9052592-B2 | Resist composition and resist pattern forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-06-09 | — | — | US | disclosed |
| US-9052592-B2 | Resist composition and resist pattern forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-06-09 | — | — | US | disclosed |
| EP-1903394-B1 | Resist composition, resin for use in the resist composition, and pattern-forming method using the resist composition | FUJIFILM CORP (JP) | 2015-04-29 | — | — | EP | disclosed |
| EP-1780224-B1 | MULTIBRANCHED POLYMERS AND PROCESS FOR PRODUCTION THEREOF | NIPPON SODA CO (JP) | 2015-02-18 | — | — | EP | disclosed |
| US-8895225-B2 | Method of forming patterns | FUJIFILM CORPORATION (JP) | 2014-11-25 | — | — | US | disclosed |
| US-20140287360-A1 | RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2014-09-25 | — | — | US | disclosed |
| US-20140287360-A1 | RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2014-09-25 | — | — | US | disclosed |
| US-20080206669-A1 | POSITIVE WORKING RESIST COMPOSITION AND PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2008-08-28 | — | — | US | disclosed |
| US-7399806-B2 | Synthesis of photoresist polymers | SYMYX TECHNOLOGIES, INC. (US) | 2008-07-15 | — | — | US | disclosed |
| EP-1903394-A1 | Resist composition, resin for use in the resist composition, and pattern-forming method using the resist composition | FUJIFILM Corporation (JP) | 2008-03-26 | — | — | EP | disclosed |
| US-20070224538-A1 | Positive Resist Compositions and Process for the Formation of Resist Patterns With the Same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-09-27 | — | — | US | disclosed |
| US-20070196766-A1 | Photosensitive composition, pattern-forming method using the photosensitive composition and compounds used in the photosensitive composition | FUJIFILM CORPORATION (JP) | 2007-08-23 | — | — | US | disclosed |
| US-20070141512-A1 | Photosensitive composition, pattern-forming method using the photosensitve composition and compound in the photosensitive composition | FUJIFILM CORPORATION (JP) | 2007-06-21 | — | — | US | disclosed |
| EP-1767992-A1 | Positive resist composition for immersion exposure and pattern forming method using the same | FUJIFILM Corporation (JP) | 2007-03-28 | — | — | EP | disclosed |
| EP-1764647-A2 | Positive resist composition for immersion exposure and pattern-forming method using the same | FUJIFILM Corporation (JP) | 2007-03-21 | — | — | EP | disclosed |
| US-20070042290-A1 | resin containing acrylic ester monomers capable of increasing solubility in alkali developer by action of acid, acid generator, aryldicycloalkylsulfonium compounds, and nonionic surfactant; semiconductors, integrated circuits | FUJI PHOTO FILM CO., LTD. | 2007-02-22 | — | — | US | disclosed |
| EP-1752479-A1 | ACRYLIC STAR POLYMER | NIPPON SODA CO., LTD. (JP) | 2007-02-14 | — | — | EP | disclosed |