SCHEMBL1728463

SCHEMBL1728463

CC(C)(CCC(C)(C)C(=O)c1ccccc1)C(=O)c1ccccc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES1 P23141 7/20 0.52
SRC P12931 1/20 0.47
TDP1 Q9NUW8 2/20 0.44
MAPK1 P28482 2/20 0.44
PRSS1 P07477 1/20 0.44
CTSG P08311 1/20 0.44
CTRB1 P17538 1/20 0.44
CMA1 P23946 1/20 0.44
KDM4E B2RXH2 1/20 0.44
MEN1 O00255 1/20 0.44
CYP3A4 P08684 1/20 0.44
MAPT P10636 1/20 0.44
HPGD P15428 1/20 0.44
ALOX15 P16050 1/20 0.44
KMT2A Q03164 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
POLB P06746 1/20 0.44
CES2 O00748 4/20 0.44
TSHR P16473 3/20 0.44
ALDH1A1 P00352 3/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrogen Peroxide SCHEMBL29060971 1.00 CES1 (0.52) CES1SRCTDP1MAPK1PRSS1
SCHEMBL9321972 0.90 PPARA (0.47) CES1SRCTDP1PRSS1CTSG
SCHEMBL28442493 0.90 CES1 (0.47) CES1SRCTDP1MAPK1PRSS1
SCHEMBL1645558 0.90 CES1 (0.47) CES1SRCTDP1MAPK1PRSS1
SCHEMBL27835153 0.88 SRC (0.46) CES1SRCTDP1MAPK1PRSS1
SCHEMBL11762158 0.86 CES1 (0.44) CES1SRCTDP1MAPK1PRSS1
SCHEMBL26064181 0.86 CES1 (0.49) CES1SRCPRSS1CTSGCTRB1
SCHEMBL18648718 0.85 CES1 (0.42) CES1SRCTDP1MAPK1PRSS1
SCHEMBL11706272 0.85 KMT2A (0.53) CES1SRCMEN1CYP3A4KMT2A
SCHEMBL6223670 0.84 RIPK1 (0.50) CES1SRCTDP1MAPK1PRSS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119875110-A Polyphenylene ether, polyphenylene ether solution, resin film, prepreg, and metal-clad laminate 旭化成株式会社 2025-04-25 CN disclosed
CN-119875032-A Resin composition, resin film, prepreg, and metal-clad laminate 旭化成株式会社 2025-04-25 CN disclosed
CN-113767149-B Low dielectric resin composition, molded article, film, laminated film, and flexible printed wiring board 株式会社钟化 2025-02-11 CN disclosed
CN-119384460-A Fluororubber composition NOK株式会社 2025-01-28 CN disclosed
CN-119343241-A Laminate and method for producing laminate 旭化成株式会社 2025-01-21 CN disclosed
WO-2023163076-A1 SURFACE-MODIFYING SHEET, MULTILAYER OBJECT, SURFACE-MODIFIED MEMBER, COATED OBJECT, BONDED OBJECT, METHOD FOR PRODUCING SURFACE-MODIFIED MEMBER, METHOD FOR PRODUCING COATED OBJECT, AND METHOD FOR PRODUCING BONDED OBJECT 日東電工株式会社 2023-08-31 WO disclosed
CN-112639025-B Resin molded body and resin composition 古河电气工业株式会社 2023-07-04 CN disclosed
CN-214830077-U Temporary fixation complex 日东电工株式会社 2021-11-23 CN disclosed
CN-113493659-A Temporary fixation complex 日东电工株式会社 2021-10-12 CN disclosed
EP-2395030-B1 Vinylidene fluoride homopolymer DAIKIN IND LTD (JP) 2017-09-20 EP disclosed
US-20100093962-A1 METHOD OF FORMING THIN FILM DAIKIN INDUSTRIES, LTD. (JO) 2010-04-15 US disclosed
US-7655742-B2 Method of forming thin film DAIKIN INDUSTRIES, LTD. (JP) 2010-02-02 US disclosed
US-7517548-B2 Polymerizing vinylidene fluoride in the presence of a free radical catalyst to form a green powder having a specific crystal structure; forming a film of the polyvinylidene fluoride; and subjectng the film to polarization DAIKIN INDUSTRIES, LTD. (JP) 2009-04-14 US disclosed
US-20070231462-A1 Method of forming ferroelectric thin film DAIKIN INDUSTRIES, LTD. 2007-10-04 US disclosed
US-20070190334-A1 Method of forming thin film of vinylidene fluoride homopolymer DAIKIN INDUSTRIES, LTD. (JP) 2007-08-16 US disclosed
EP-1743710-A1 PROCESS FOR FORMING VINYLIDENE FLUORIDE HOMOPOLYMER THIN FILMS DAIKIN INDUSTRIES, LTD. (JP) 2007-01-17 EP disclosed
US-20060189788-A1 Cyclic ether copolymer, coating resin composition, optical devices, and process for production of the devices DAIKIN INDUSTRIES, LTD. (JP) 2006-08-24 US disclosed
US-20060014912-A1 preparing a green powder product of polyvinylidene fluoride comprising crystal form by subjecting vinylidene fluoride to radical polymerization in the presence of a bromine or iodine compound having 1 to 20 carbon atoms which contains perfluoroalyl groups as chain transferring agent; ferroelectricity DAIKIN INDUSTRIES, LTD. 2006-01-19 US disclosed
EP-1607417-A1 METHOD OF FORMING THIN FILM Daikin Industries, Ltd. (JP) 2005-12-21 EP disclosed
EP-1607986-A1 METHOD FOR FORMING FERROELECTRIC THIN FILM Daikin Industries, Limited (JP) 2005-12-21 EP disclosed