SCHEMBL17289487

SCHEMBL17289487

C[Si](C)(C)O[Si](C)(CCC(=O)CC1CO1)O[Si](C)(C)C

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4265755 0.84 ALDH1A1 (0.36) ALDH1A1
SCHEMBL1283648 0.81 ALDH1A1 (0.31) ALDH1A1
SCHEMBL720793 0.77 ALDH1A1 (0.33) ALDH1A1
SCHEMBL4271797 0.75 ALDH1A1 (0.31) ALDH1A1
SCHEMBL10915445 0.72 ALDH1A1 (0.33) ALDH1A1
SCHEMBL10966085 0.70 ALDH1A1 (0.38) ALDH1A1
SCHEMBL6861024 0.67
SCHEMBL10495794 0.67 ALDH1A1 (0.33) ALDH1A1
SCHEMBL17265366 0.66
SCHEMBL29236030 0.66 CAMK2A (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10483011-B2 Conductive composition, conductive composition production method, anti-static resin composition and antistatic resin film SHIN-ETSU POLYMER CO., LTD. (JP) 2019-11-19 US disclosed
EP-2957597-A1 CONDUCTIVE COMPOSITION, CONDUCTIVE COMPOSITION PRODUCTION METHOD, ANTI-STATIC RESIN COMPOSITION AND ANTISTATIC RESIN FILM Shin-Etsu Polymer Co. Ltd. (JP) 2015-12-23 EP disclosed
US-20150348671-A1 CONDUCTIVE COMPOSITION, CONDUCTIVE COMPOSITION PRODUCTION METHOD, ANTI-STATIC RESIN COMPOSITION AND ANTISTATIC RESIN FILM SHIN-ETSU POLYMER CO., LTD. (JP) 2015-12-03 US disclosed
US-20150348670-A1 CURABLE ANTISTATIC ORGANOPOLYSILOXANE COMPOSITION AND ANTISTATIC SILICONE FILM SHIN-ETSU POLYMER CO., LTD. (JP) 2015-12-03 US disclosed