SCHEMBL17309677

SCHEMBL17309677

C1CN=C2CCCN2C1.c1ccc([B-](c2ccccc2)(c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
INMT O95050 4/20 0.55
USP2 O75604 2/20 0.55
ACHE P22303 5/20 0.38
BCHE P06276 1/20 0.38
ALDH1A1 P00352 2/20 0.37
MEN1 O00255 1/20 0.37
LMNA P02545 1/20 0.37
CYP3A4 P08684 1/20 0.37
KMT2A Q03164 1/20 0.37
CHRNB4 P30926 1/20 0.37
CHRNA3 P32297 1/20 0.37
SIGMAR1 Q99720 1/20 0.36
ACP1 P24666 1/20 0.33
KDM4E B2RXH2 1/20 0.33
NPC1 O15118 1/20 0.33
GAA P10253 1/20 0.33
MAPT P10636 1/20 0.33
HPGD P15428 1/20 0.33
RAB9A P51151 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17309688 0.94 INMT (0.66) INMTUSP2ACHEALDH1A1CHRNB4
SCHEMBL2927 0.80
SCHEMBL17417845 0.80
SCHEMBL29707902 0.78 INMT (0.78) INMTUSP2ACHEBCHEALDH1A1
Water SCHEMBL6561823 0.78 INMT (0.78) INMTUSP2ACHEBCHEALDH1A1
Ammonia Solution, Strong SCHEMBL23880360 0.78 INMT (0.78) INMTUSP2ACHEBCHEALDH1A1
Hydrochloric Acid SCHEMBL10432356 0.78 INMT (0.78) INMTUSP2ACHEBCHEALDH1A1
Ammonia Solution, Strong SCHEMBL6834960 0.78 INMT (0.78) INMTUSP2ACHEBCHEALDH1A1
Pyridine SCHEMBL22832248 0.77 INMT (0.60) INMTUSP2ACHEBCHEALDH1A1
SCHEMBL28761105 0.76 TSHR (0.42) INMTUSP2ALDH1A1MEN1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3916033-B1 ONE COMPONENT (1K) COMPOSITION BASED ON EPOXY RESIN HENKEL AG & CO KGAA (DE) 2025-10-29 EP claimed
US-12338342-B2 One component (1K) composition based on epoxy resin HENKEL AG & CO. KGAA (DE) 2025-06-24 US claimed
CN-114207043-B Composition for producing siliceous film having low dielectric constant and method for producing cured film and electronic device using the same 默克专利有限公司 2023-09-15 CN claimed
EP-4010441-B1 LOW DIELECTRIC CONSTANT SILICEOUS FILM MANUFACTURING COMPOSITION AND METHODS FOR PRODUCING CURED FILM AND ELECTRONIC DEVICE USING THE SAME MERCK PATENT GMBH (DE) 2023-09-06 EP claimed
EP-3831863-B1 ONE COMPONENT (1K) COMPOSITION BASED ON EPOXY RESIN HENKEL AG & CO KGAA (DE) 2023-07-05 EP claimed
EP-3831862-B1 ONE COMPONENT (1K) COMPOSITION BASED ON EPOXY RESIN HENKEL AG & CO KGAA (DE) 2023-06-28 EP claimed
US-20230108593-A1 One Component Liquid Resin Composition HENKEL AG & CO KGAA (DE) 2023-04-06 US claimed
US-11512171-B2 Low dielectric constant siliceous film manufacturing composition and methods for producing cured film and electronic device using the same MERCK PATENT GMBH (DE) 2022-11-29 US claimed
US-20220298327-A1 ONE COMPONENT (1K) COMPOSITION BASED ON EPOXY RESIN HENKEL AG & CO KGAA (DE) 2022-09-22 US claimed
US-20220298283-A1 ONE COMPONENT (1K) COMPOSITION BASED ON EPOXY RESIN HENKEL AG & CO KGAA (DE) 2022-09-22 US claimed
US-11427718-B2 Vat resin with additives for thiourethane polymer stereolithography printing BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (US) 2022-08-30 US claimed
US-20220267532-A1 LOW DIELECTRIC CONSTANT SILICEOUS FILM MANUFACTURING COMPOSITION AND METHODS FOR PRODUCING CURED FILM AND ELECTRONIC DEVICE USING THE SAME MERCK PATENT GMBH (DE) 2022-08-25 US claimed
EP-4010441-A1 LOW DIELECTRIC CONSTANT SILICEOUS FILM MANUFACTURING COMPOSITION AND METHODS FOR PRODUCING CURED FILM AND ELECTRONIC DEVICE USING THE SAME Merck Patent GmbH (DE) 2022-06-15 EP claimed
EP-3916033-A1 ONE COMPONENT (1K) COMPOSITION BASED ON EPOXY RESIN Henkel AG & Co. KGaA (DE) 2021-12-01 EP claimed
EP-3831863-A1 ONE COMPONENT (1K) COMPOSITION BASED ON EPOXY RESIN Henkel AG & Co. KGaA (DE) 2021-06-09 EP claimed
EP-3831862-A1 ONE COMPONENT (1K) COMPOSITION BASED ON EPOXY RESIN Henkel AG & Co. KGaA (DE) 2021-06-09 EP claimed
WO-2021028297-A1 LOW DIELECTRIC CONSTANT SILICEOUS FILM MANUFACTURING COMPOSITION AND METHODS FOR PRODUCING CURED FILM AND ELECTRONIC DEVICE USING THE SAME MERCK PATENT GMBH (DE) 2021-02-18 WO claimed
US-12577344-B2 One component (1K) composition based on epoxy resin HENKEL AG & CO. KGAA (DE) 2026-03-17 US disclosed
US-20150353731-A1 HEAT-CURABLE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-12-10 US disclosed
EP-2952539-A1 HEAT-CURABLE RESIN COMPOSITION Shin-Etsu Chemical Co., Ltd. (JP) 2015-12-09 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12577344-B2 One component (1K) composition based on epoxy resin CBR1, AGTR1, SMARCC1 INMT 4319/4885USP2 4028/4885ACHE 2399/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.