SCHEMBL17320626

SCHEMBL17320626

O=c1oc(=O)c2cc3oc4cc5c(=O)oc(=O)c5cc4oc3cc12

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDE2A O00408 1/20 0.41
PKLR P30613 3/20 0.39
MAPT P10636 6/20 0.38
KDM4E B2RXH2 4/20 0.38
NPC1 O15118 4/20 0.38
RAB9A P51151 4/20 0.38
ALDH1A1 P00352 3/20 0.38
POLB P06746 2/20 0.38
STAT1 P42224 1/20 0.38
PKM P14618 2/20 0.36
ALPL P05186 1/20 0.36
ALPI P09923 1/20 0.36
SMN1; SMN2 Q16637 4/20 0.36
HPGD P15428 3/20 0.36
MAOA P21397 2/20 0.36
HSD17B10 Q99714 2/20 0.36
GLA P06280 1/20 0.36
CYP3A4 P08684 1/20 0.36
PGAM1 P18669 1/20 0.36
CASP1 P29466 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15763 0.83 CYP1A2 (0.43) PDE2APKLRMAPTKDM4ENPC1
SCHEMBL17456072 0.80 CYP1A2 (0.42) PDE2APKLRMAPTKDM4ENPC1
SCHEMBL10406762 0.80 CYP1A2 (0.42) PDE2APKLRMAPTKDM4ENPC1
SCHEMBL25994740 0.80 CYP1A2 (0.42) PDE2APKLRMAPTKDM4ENPC1
SCHEMBL19719140 0.77 SMN1; SMN2 (0.39) PDE2AMAPTKDM4ENPC1RAB9A
SCHEMBL7002418 0.75 ELANE (0.38) PDE2APKLRMAPTKDM4ENPC1
SCHEMBL12124170 0.73 MAPT (0.35) MAPTKDM4ENPC1RAB9AALDH1A1
SCHEMBL10017612 0.73 CYP1A2 (0.38) PDE2APKLRMAPTKDM4ENPC1
SCHEMBL23260301 0.71 KMT2A (0.53) PDE2AMAPTKDM4ENPC1RAB9A
SCHEMBL15695591 0.71 PDE2A (0.34) PDE2APKLRMAPTKDM4ENPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9751984-B2 Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2017-09-05 US disclosed
US-9751984-B2 Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2017-09-05 US disclosed
US-20150353685-A1 POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID POLYIMIDE PRECURSOR, AND CURED-PATTERN-FILM MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING SAID PHOTOSENSITIVE RESIN COMPOSITION HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2015-12-10 US disclosed
US-20150353685-A1 POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID POLYIMIDE PRECURSOR, AND CURED-PATTERN-FILM MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING SAID PHOTOSENSITIVE RESIN COMPOSITION HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2015-12-10 US disclosed