SCHEMBL17322751

SCHEMBL17322751

CCCC1(C2CCCCC2)c2ccc(/C(C)=N\OC(C)=O)cc2-c2ccc(C(=O)c3ccccc3C)cc21

nearest known ligand 0.31

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
▸ FFAR1 O14842 1/20 0.31
▸ ALDH1A1 P00352 1/20 0.31
▸ MAPT P10636 1/20 0.31
▸ HPGD P15428 1/20 0.31
▸ PDE4B Q07343 1/20 0.31
▸ PDE4D Q08499 1/20 0.31
▸ MAPK14 Q16539 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17282533 0.84 ALDH1A1 (0.34) ALDH1A1MAPTMAPK14
SCHEMBL22236591 0.83 ALDH1A1 (0.33) ALDH1A1MAPTMAPK14
SCHEMBL17084350 0.82 ALDH1A1 (0.36) ALDH1A1MAPTMAPK14
SCHEMBL17877627 0.82 ALDH1A1 (0.36) ALDH1A1MAPTMAPK14
SCHEMBL29789550 0.82 ALDH1A1 (0.36) ALDH1A1MAPTMAPK14
SCHEMBL17056227 0.82 ALDH1A1 (0.36) ALDH1A1MAPTMAPK14
SCHEMBL19307923 0.79 ALDH1A1 (0.37) ALDH1A1MAPTHPGDMAPK14
SCHEMBL18220805 0.79 NPC1 (0.39) ALDH1A1MAPTHPGD
SCHEMBL18122994 0.77 FFAR1 (0.33) FFAR1
SCHEMBL17056226 0.77 ALDH1A1 (0.34) ALDH1A1MAPTMAPK14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9751984-B2 Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2017-09-05 — — US disclosed
US-20150353685-A1 POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID POLYIMIDE PRECURSOR, AND CURED-PATTERN-FILM MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING SAID PHOTOSENSITIVE RESIN COMPOSITION HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2015-12-10 — — US disclosed
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