Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.37 |
| ▸ | THRB | P10828 | 1/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL238944 | 0.88 | TSHR (0.43) | TSHRTHRBALDH1A1 | |
| SCHEMBL8085073 | 0.83 | THRB (0.36) | TSHRTHRBALDH1A1HSD17B10TDP1 | |
| SCHEMBL28214326 | 0.78 | TDP1 (0.33) | TSHRALDH1A1HSD17B10TDP1 | |
| SCHEMBL17350347 | 0.75 | TSHR (0.39) | TSHRTHRBALDH1A1HSD17B10 | |
| SCHEMBL472262 | 0.73 | TSHR (0.48) | TSHRALDH1A1HSD17B10TDP1 | |
| SCHEMBL18513832 | 0.72 | HTT (0.32) | — | |
| SCHEMBL25748771 | 0.72 | THRB (0.36) | TSHRTHRB | |
| SCHEMBL12534552 | 0.72 | TSHR (0.33) | TSHRTHRBALDH1A1 | |
| SCHEMBL4805525 | 0.72 | THRB (0.41) | TSHRTHRBALDH1A1 | |
| SCHEMBL28795023 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-102858902-B | Thermally expandable microcapsule and process for production of thermally expandable microcapsule | SEKISUI CHEMICAL CO LTD | 2015-06-03 | — | — | CN | claimed |
| EP-2960314-B1 | POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE | FUJIMI INC (JP) | 2024-06-26 | — | — | EP | disclosed |
| EP-3159915-B1 | METHOD FOR POLISHING SILICON WAFER, POLISHING COMPOSITION, AND POLISHING COMPOSITION SET | FUJIMI INC (JP) | 2023-12-06 | — | — | EP | disclosed |
| CN-110462797-B | Polishing composition | 福吉米株式会社 | 2023-09-22 | — | — | CN | disclosed |
| EP-3133638-B1 | COMPOSITION FOR POLISHING SILICON WAFERS | FUJIMI INC (JP) | 2021-10-27 | — | — | EP | disclosed |
| EP-2957613-B1 | POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE | FUJIMI INC (JP) | 2020-11-18 | — | — | EP | disclosed |
| US-10745588-B2 | Silicon wafer polishing composition | FUJIMI INCORPORATED (JP) | 2020-08-18 | — | — | US | disclosed |
| EP-3007213-B1 | USE OF A COMPOSITION FOR SILICON WAFER POLISHING | FUJIMI INC (JP) | 2020-03-18 | — | — | EP | disclosed |
| EP-3605588-A1 | POLISHING COMPOSITION | Fujimi Incorporated (JP) | 2020-02-05 | — | — | EP | disclosed |
| EP-3133639-B1 | COMPOSITION FOR POLISHING SILICON WAFERS | FUJIMI INC (JP) | 2019-06-26 | — | — | EP | disclosed |
| EP-3133639-A1 | COMPOSITION FOR POLISHING SILICON WAFERS | Fujimi Incorporated (JP) | 2017-02-22 | — | — | EP | disclosed |
| EP-3133638-A1 | COMPOSITION FOR POLISHING SILICON WAFERS | Fujimi Incorporated (JP) | 2017-02-22 | — | — | EP | disclosed |
| US-9566685-B2 | Polishing composition and method for producing polished article | FUJIMI INCORPORATED (JP) | 2017-02-14 | — | — | US | disclosed |
| US-20160122591-A1 | SILICON WAFER POLISHING COMPOSITION | FUJIMI INCORPORATED (JP) | 2016-05-05 | — | — | US | disclosed |
| EP-3007213-A1 | COMPOSITION FOR SILICON WAFER POLISHING | Fujimi Incorporated (JP) | 2016-04-13 | — | — | EP | disclosed |
| US-20160001416-A1 | POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE | FUJIMI INCORPORATED (JP) | 2016-01-07 | — | — | US | disclosed |
| US-20150376464-A1 | POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE | FUJIMI INCORPORATED (JP) | 2015-12-31 | — | — | US | disclosed |
| EP-2960314-A1 | POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE | Fujimi Incorporated (JP) | 2015-12-30 | — | — | EP | disclosed |
| EP-2957613-A1 | POLISHING COMPOSITION, PRODUCTION METHOD FOR POLISHING COMPOSITION, AND PRODUCTION METHOD FOR POLISHED ARTICLE | Fujimi Incorporated (JP) | 2015-12-23 | — | — | EP | disclosed |
| CN-102858902-B | Thermally expandable microcapsule and process for production of thermally expandable microcapsule | SEKISUI CHEMICAL CO LTD | 2015-06-03 | — | — | CN | disclosed |