SCHEMBL17358693

SCHEMBL17358693

CC(COCC1CO1)OCC(C)OCC(C)OCC(C)OCC(C)OCC(C)OCC(C)OCC1CO1

nearest known ligand 0.45

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.45
TSHR P16473 2/20 0.42
MAPK1 P28482 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.41
TDP1 Q9NUW8 2/20 0.39
GLA P06280 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL138322 1.00 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL1095965 1.00 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL19410606 1.00 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL19410597 1.00 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL19410608 1.00 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL19410575 1.00 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL1094765 1.00 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL475462 1.00 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
SCHEMBL40032 0.96 ALDH1A1 (0.47) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1
Ammonia Solution, Strong SCHEMBL28794546 0.94 ALDH1A1 (0.46) ALDH1A1TSHRMAPK1SMN1; SMN2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112882342-A Laminated body 旭化成株式会社 2021-06-01 CN disclosed
CN-107077067-B Photosensitive resin composition, photosensitive resin laminate, method for producing resin pattern, cured film, and display device 旭化成株式会社 2021-04-13 CN disclosed
CN-106997148-B Laminated body 旭化成株式会社 2020-12-29 CN disclosed
US-10338468-B2 Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-07-02 US disclosed
US-9790398-B2 Synthesis of polyurethane polymers via copper azide-alkyne click chemistry for coatings, adhesives, sealants and elastomer applications SIKA TECHNOLOGY AG (CH) 2017-10-17 US disclosed
US-20170285474-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, RESIN PATTERN PRODUCTION METHOD, CURED FILM, AND DISPLAY DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2017-10-05 US disclosed
US-9752066-B2 Adhesive composition ROHM AND HAAS COMPANY (US) 2017-09-05 US disclosed
US-9751977-B2 Epoxy-terminated polyester ROHM AND HAAS COMPANY (US) 2017-09-05 US disclosed
US-20160289518-A1 ADHESIVE COMPOSITION ARKEMA FRANCE (FR) 2016-10-06 US disclosed
US-20160264724-A1 EPOXY-TERMINATED POLYESTER ARKEMA FRANCE (FR) 2016-09-15 US disclosed
US-20150368530-A1 SYNTHESIS OF POLYURETHANE POLYMERS VIA COPPER AZIDE-ALKYNE CLICK CHEMISTRY FOR COATINGS, ADHESIVES, SEALANTS AND ELASTOMER APPLICATIONS SIKA TECHNOLOGY AG (CH) 2015-12-24 US disclosed