SCHEMBL1741133

SCHEMBL1741133

CC(C)CC[Si](Cl)(Cl)Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9633593 0.81 LMNA (0.41)
SCHEMBL8166669 0.80 LMNA (0.32)
SCHEMBL10686976 0.80 LMNA (0.32)
SCHEMBL16594080 0.79 LMNA (0.59)
SCHEMBL10699755 0.78
SCHEMBL28958675 0.78
SCHEMBL2450401 0.78
SCHEMBL23658243 0.77 LMNA (0.43)
SCHEMBL1204209 0.77 LMNA (0.43)
SCHEMBL2408297 0.77 LMNA (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8247589-B2 Organic silicon phosphate and fabrication method thereof GRAND TEK ADVANCE MATERIAL SCIENCE CO., LTD. (TW) 2012-08-21 US claimed
CN-102146100-A Organic silicon phosphate and preparation method thereof GUANGKE INDUSTRY CO LTD 2011-08-10 CN claimed
US-20110160475-A1 ORGANIC SILICON PHOSPHATE AND FABRICATION METHOD THEREOF GRAND TEK ADVANCE MATERIAL SCIENCE CO., LTD. (TW) 2011-06-30 US claimed
EP-3070137-B1 SILICONE ADHESIVE COMPOSITION AND SOLID-STATE IMAGING DEVICE SHINETSU CHEMICAL CO (JP) 2023-12-27 EP disclosed
CN-106176250-B Tooth adhesive system based on new hydrophobic adhesion concept 浙江大学 2020-06-23 CN disclosed
CN-105722939-B Silicone adhesive composition and solid-state imaging device 信越化学工业株式会社 2019-12-17 CN disclosed
EP-2387502-B1 METHOD FOR TREATING A HYDROPHILIC SURFACE SAKHRANI VINAY G (US) 2018-11-14 EP disclosed
EP-2578656-B1 Temporary adhesive composition and method for manufacturing thin wafer using the same SHINETSU CHEMICAL CO (JP) 2018-02-28 EP disclosed
US-9796892-B2 Silicone adhesive composition and solid-state imaging device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-24 US disclosed
US-9550931-B2 Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-01-24 US disclosed
CN-106176250-A Tooth bonding agent system based on hydrophobic bonding new concept 浙江大学 2016-12-07 CN disclosed
EP-0669347-B1 Ethylene polymer, and process for preparing the same MITSUI PETROCHEMICAL IND (JP) 1998-05-06 EP disclosed
EP-0668296-B1 Ethylene polymer and process for preparing the same MITSUI PETROCHEMICAL IND (JP) 1998-05-06 EP disclosed
US-5731393-A Ethylene polymer, process for preparing the same, solid titanium catalyst component for ethylene polymerization and ethylene polymerization catalyst MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1998-03-24 US disclosed
CN-1126728-A Ethylene polymer and process for preparing the same MITSUI PETROCHEMICAL IND (JP) 1996-07-17 CN disclosed
CN-1109892-A Ethylene polymer, process for preparing the same, solid titanium catalyst component for ethylene polymerization and ethylene polymerization catalyst MITSUI PETROCHEMICAL IND (JP) 1995-10-11 CN disclosed
EP-0669347-A1 Ethylene polymer, process for preparing the same, solid titanium catalyst component for ethylene polymerization and ethylene polymerization catalyst MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1995-08-30 EP disclosed
EP-0668296-A1 Ethylene polymer and process for preparing the same MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1995-08-23 EP disclosed
US-4978462-A SOFTENERS; BLENDS INCLUDES A CATIONIC SOFTENER DOW CORNING LIMITED (GB) 1990-12-18 US disclosed
US-4840781-A Process for producing a silicon carbide CHISSO CORPORATION (JP) 1989-06-20 US disclosed