SCHEMBL23658243

SCHEMBL23658243

CC(C)CCCCCCCCCCCCCCC[Si](Cl)(Cl)Cl

nearest known ligand 0.43

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2408297 1.00 LMNA (0.43) LMNA
SCHEMBL1204209 1.00 LMNA (0.43) LMNA
SCHEMBL27935438 0.93 LMNA (0.39) LMNA
SCHEMBL9633593 0.89 LMNA (0.41) LMNA
Fluoride SCHEMBL28261259 0.89 OPRM1 (0.38) LMNA
SCHEMBL28890617 0.84 LMNA (0.43) LMNA
SCHEMBL21198610 0.82 LMNA (0.42) LMNA
SCHEMBL1741133 0.77
SCHEMBL4821269 0.77
SCHEMBL6048942 0.77 LMNA (0.37) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110660761-B Heat-conducting structure or semiconductor device 丰田自动车株式会社 2023-10-20 CN disclosed
US-11075140-B2 Heat conduction structure or semiconductor apparatus TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) 2021-07-27 US disclosed
CN-110660761-A Thermally conductive structure or semiconductor device 丰田自动车株式会社 2020-01-07 CN disclosed