SCHEMBL1741609

SCHEMBL1741609

Cc1cc(N2C(=O)C=CC2=O)ccc1N1C(=O)C=CC1=O

nearest known ligand 0.61

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TLR9 Q9NR96 2/20 0.61
G6PD P11413 1/20 0.61
MGLL Q99685 16/20 0.57
FAAH O00519 4/20 0.54
HSP90AA1 P07900 4/20 0.53
CCR6 P51684 1/20 0.50
PKM P14618 1/20 0.45
MAPK1 P28482 1/20 0.45
NPSR1 Q6W5P4 1/20 0.45
TDP1 Q9NUW8 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29898506 1.00 TLR9 (0.61) TLR9G6PDMGLLFAAHHSP90AA1
SCHEMBL94095 0.84 MGLL (0.57) TLR9G6PDMGLLFAAHHSP90AA1
SCHEMBL1164427 0.83 MGLL (0.59) TLR9G6PDMGLLFAAHHSP90AA1
SCHEMBL30435094 0.83 MGLL (0.59) TLR9G6PDMGLLFAAHHSP90AA1
SCHEMBL3183796 0.82 HPGD (0.63) TLR9G6PDMGLLFAAHHSP90AA1
SCHEMBL717739 0.82 MGLL (0.59) TLR9G6PDMGLLHSP90AA1CCR6
SCHEMBL30104193 0.82 HPGD (0.63) TLR9G6PDMGLLFAAHHSP90AA1
SCHEMBL22399177 0.82 MGLL (0.57) TLR9G6PDMGLLFAAHHSP90AA1
SCHEMBL29485049 0.82 MGLL (0.59) TLR9G6PDMGLLHSP90AA1CCR6
SCHEMBL19565018 0.81 MGLL (0.66) TLR9G6PDMGLLFAAHHSP90AA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 138 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117645771-A Solvent-free high-low temperature resistant bulletproof composite matrix resin and preparation method thereof 上海鑫丰泰新材料科技有限公司 2024-03-05 CN claimed
US-20160369099-A1 THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPREG AND METAL CLAD LAMINATE USING THE SAME LG CHEM, LTD. (KR) 2016-12-22 US claimed
EP-1027206-B1 UNIDIRECTIONAL FIBER-RANDOM MAT PREFORM DOW CHEMICAL CO (US) 2003-05-02 EP claimed
EP-0759842-B1 METHOD FOR PREPARING PREFORMS FOR MOLDING PROCESSES DOW CHEMICAL CO (US) 2002-01-02 EP claimed
US-6096669-A Unidirectional fiber-random mat preform GKN WESTLAND AEROSPACE INC. (US) 2000-08-01 US claimed
EP-0759842-A1 METHOD FOR PREPARING PREFORMS FOR MOLDING PROCESSES THE DOW CHEMICAL COMPANY (US) 1997-03-05 EP claimed
US-5480603-A COATING PREFORMS AND REINFORCING FIBERS WITH TACKIFIERS RESINS WITH DRYING TO FORM A COATING THE DOW CHEMICAL COMPANY (US) 1996-01-02 US claimed
WO-1995032085-A1 METHOD FOR PREPARING PREFORMS FOR MOLDING PROCESSES THE DOW CHEMICAL COMPANY (US) 1995-11-30 WO claimed
US-5427726-A Partially curing first curable resin, thermoplastic like tacifier is romped and capable of further curing, cotacting with reinforcing substrate, fully curing, placing formed preform into a mold, injecting second curable resin THE DOW CHEMICAL COMPANY (US) 1995-06-27 US claimed
WO-1993011848-A1 REPAIR OF FILTRATION ELEMENTS FOR POLYMER MANUFACTURE WELLMAN, INC. (US) 1993-06-24 WO claimed
US-5217659-A Repair of filtration elements for polymer manufacture WELLMAN, INC. (US) 1993-06-08 US claimed
EP-0323161-A1 Imide prepolymer MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-07-05 EP claimed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-20250251663-A1 PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-08-07 US disclosed
CN-120153318-A Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film 旭化成株式会社 2025-06-13 CN disclosed
CN-120129876-A Negative photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film 旭化成株式会社 2025-06-10 CN disclosed
EP-0410152-B1 Rubber composition having excellent dynamic properties SUMITOMO CHEMICAL CO (JP) 1994-02-23 EP disclosed
US-5109055-A Blend with a dinitrodiamine compound with n-(cyclohexylthio)-phthalimide and(or) 2,3,5,6-tetrachloro-1,4-benzoqionone SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1992-04-28 US disclosed
EP-0410152-A1 Rubber composition having excellent dynamic properties SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1991-01-30 EP disclosed
EP-0323161-A1 Imide prepolymer MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-07-05 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 TLR9 3448/4885G6PD 2531/4885MGLL 4248/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.