SCHEMBL17417868

SCHEMBL17417868

C=COC(C)C(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17417871 0.79
SCHEMBL14369594 0.77
SCHEMBL17417862 0.75
SCHEMBL13236673 0.75
SCHEMBL16446947 0.74
SCHEMBL164470 0.74
SCHEMBL16687329 0.74
SCHEMBL4258778 0.74
SCHEMBL1447898 0.72
SCHEMBL1448054 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210108065-A1 POLYMERS AND PHOTORESIST COMPOSITIONS DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC 2021-04-15 US disclosed
CN-111063474-A Stretchable conductive fluoroelastomer paste composition 杜邦电子公司 2020-04-24 CN disclosed
EP-3166170-B1 ELECTROLYTE SOLUTION FOR NON-AQUEOUS ELECTROLYTE SOLUTION BATTERY AND NON-AQUEOUS ELECTROLYTE SOLUTION BATTERY USING SAME CENTRAL GLASS CO LTD (JP) 2019-09-11 EP disclosed
US-9927708-B2 Pattern forming process and shrink agent SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-03-27 US disclosed
US-9879153-B2 Anti-icing composite WANG LIANG (US) 2018-01-30 US disclosed
US-20160202612-A1 PATTERN FORMING PROCESS AND SHRINK AGENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-07-14 US disclosed
US-20160009971-A1 Anti-Icing Composite WANG LIANG (US) 2016-01-14 US disclosed