SCHEMBL1744488

SCHEMBL1744488

O=S(=O)(O)CCCSS.[NaH]

nearest known ligand 0.44

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.44
PTGS1 P23219 1/20 0.42
PDE4A P27815 1/20 0.42
LMNA P02545 1/20 0.36
SLC6A6 P31641 1/20 0.36
CYP2C19 P33261 1/20 0.36
BLM P54132 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1236327 0.97
SCHEMBL1783443 0.81
SCHEMBL1646543 0.79 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL1258894 0.79 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL565134 0.79 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL211369 0.79 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL929912 0.79 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL564743 0.77 APP (0.46) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL27175673 0.77 APP (0.46) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL220968 0.76 APP (0.50) APPPTGS1PDE4ALMNASLC6A6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220389606-A1 CELL FOR MEASURING CONCENTRATION OF ADDITIVE BREAKDOWN PRODUCTION IN PLATING SOLUTION KOREA INSTITUTE OF MATERIALS SCIENCE (KR) 2022-12-08 US claimed
WO-2021066413-A1 APPARATUS FOR MEASURING CONCENTRATION OF ADDITIVE DEGRADATION PRODUCT CONTAINED IN PLATING LIQUID 한국재료연구원 2021-04-08 WO claimed
WO-2021066415-A1 CELL FOR MEASURING CONCENTRATION OF ADDITIVE BREAKDOWN PRODUCTION IN PLATING SOLUTION KOREA INSTITUTE OF MATERIALS SCIENCE (KR) 2021-04-08 WO claimed
WO-2021066412-A1 METHOD FOR MEASURING CONCENTRATION OF ADDITIVE BREAKDOWN PRODUCTS INCLUDED IN PLATING SOLUTION 한국재료연구원 2021-04-08 WO claimed
EP-2385881-A1 PROCESS FOR IMPROVING THE ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES MacDermid-Acumen (US) 2011-11-16 EP claimed
US-8039915-B2 Solid-state image sensor FUJIFILM CORPORATION (JP) 2011-10-18 US claimed
WO-2010080227-A1 PROCESS FOR IMPROVING THE ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES MACDERMID, INCORPORATED (US) 2010-07-15 WO claimed
WO-2021066412-A1 METHOD FOR MEASURING CONCENTRATION OF ADDITIVE BREAKDOWN PRODUCTS INCLUDED IN PLATING SOLUTION 한국재료연구원 2021-04-08 WO disclosed
WO-2021066413-A1 APPARATUS FOR MEASURING CONCENTRATION OF ADDITIVE DEGRADATION PRODUCT CONTAINED IN PLATING LIQUID 한국재료연구원 2021-04-08 WO disclosed
CN-105027265-A Electrochemical deposition process for semiconductor wafers APPLIED MATERIALS INC 2015-11-04 CN disclosed
WO-2014149245-A1 ELECTROCHEMICAL DEPOSITION PROCESSES FOR SEMICONDUCTOR WAFERS APPLIED MATERIALS, INC. (US) 2014-09-25 WO disclosed
US-20140262794-A1 ELECTROCHEMICAL DEPOSITION PROCESSES FOR SEMICONDUCTOR WAFERS APPLIED MATERIALS, INC. 2014-09-18 US disclosed
WO-2009020792-A2 ELECTROPLATING AQUEOUS SOLUTION AND METHOD OF MAKING AND USING SAME EMAT TECHNOLOGY, LLC (US) 2009-02-12 WO disclosed