Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.50 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.41 |
| ▸ | PDE4A | P27815 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
| ▸ | SLC6A6 | P31641 | 1/20 | 0.41 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.41 |
| ▸ | BLM | P54132 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21808785 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL29387431 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL10484571 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL29551768 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL1646543 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL211369 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL1258894 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL929912 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| Water SCHEMBL5356503 | 0.95 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL600058 | 0.92 | APP (0.44) | APPPTGS1PDE4ALMNASLC6A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2788 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122039176-A | Conductive electroplating process of circuit carrier plate | 深圳市则成电子股份有限公司 | 2026-05-15 | — | — | CN | claimed |
| WO-2026099327-A1 | METHOD FOR PRODUCING A 3D PRINTED BONE GRAFT AND 3D PRINTED BONE GRAFT | UNIVERSITAT POLITECNICA DE CATALUNYA (ES) | 2026-05-15 | — | — | WO | claimed |
| EP-4740972-A1 | METHOD FOR PRODUCING A 3D PRINTED BONE GRAFT AND 3D PRINTED BONE GRAFT | Universitat Politècnica De Catalunya (ES) | 2026-05-13 | — | — | EP | claimed |
| EP-4729661-A1 | HIGH-TEMPERATURE ULTRAHIGH-STRENGTH HIGH-ELONGATION COPPER FOIL FOR LITHIUM-ION BATTERY, AND PRODUCTION PROCESS THEREFOR | Jiujiang Defu Technology Co., Ltd (CN) | 2026-04-22 | — | — | EP | claimed |
| US-20260078517-A1 | COMPOSITION AND METHOD FOR NANOTWINNED COPPER FORMATION | MACDERMID ENTHONE INC (US) | 2026-03-19 | — | — | US | claimed |
| US-12559853-B2 | Differential contrast plating for advanced packaging applications | LAM RESEARCH CORPORATION (US) | 2026-02-24 | — | — | US | claimed |
| US-12557687-B2 | Semiconductor package device and method for manufacturing the same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2026-02-17 | — | — | US | claimed |
| US-20260042889-A1 | SYSTEMS AND METHODS FOR SELECTIVE SHAPE TRANSFORMATION OF 3D-PRINTED MATERIALS | UNIVERSITY OF WASHINGTON (US) | 2026-02-12 | — | — | US | claimed |
| EP-4690342-A2 | SHELF STABLE ELECTROLYTE COMPOSITION, POLYMER ELECTROLYTE FREE OF VISIBLE BUBBLES AND SOLID-STATE BATTERIES COMPRISING SAME | Factorial Inc. (US) | 2026-02-11 | — | — | EP | claimed |
| US-20260016381-A1 | COMPOSITIONS AND METHODS FOR LYSING BLOOD SAMPLES COMPRISING ONE OR MORE INFECTIOUS AGENTS | BLASTID INC (US) | 2026-01-15 | — | — | US | claimed |
| WO-1994024338-A1 | PROCESS FOR MAKING COPPER FOIL | MAGMA COPPER COMPANY (US) | 1994-10-27 | — | — | WO | claimed |
| EP-0554275-A1 | ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE. | SCHERING AG (DE) | 1993-08-11 | — | — | EP | claimed |
| EP-0485588-A4 | ELECTRODEPOSITED COPPER FOIL AND PROCESS FOR MAKING SAME USING ELECTROLYTE SOLUTIONS HAVING LOW CHLORIDE ION CONCENTRATIONS | — | 1993-03-31 | — | — | EP | claimed |
| WO-1993003204-A1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1993-02-18 | — | — | WO | claimed |
| EP-0297306-B1 | AQUEOUS ACID BATH FOR THE GALVANIC DEPOSITION OF BRIGHTENING AND LEVELING COPPER COATINGS | SCHERING AKTIENGESELLSCHAFT (DE) | 1993-01-20 | — | — | EP | claimed |
| EP-0485588-A1 | ELECTRODEPOSITED COPPER FOIL AND PROCESS FOR MAKING SAME USING ELECTROLYTE SOLUTIONS HAVING LOW CHLORIDE ION CONCENTRATIONS. | GOULD INC (US) | 1992-05-20 | — | — | EP | claimed |
| WO-1992007116-A1 | ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE | SCHERING AKTIENGESELLSCHAFT (DE) | 1992-04-30 | — | — | WO | claimed |
| WO-1991019024-A1 | ELECTRODEPOSITED COPPER FOIL AND PROCESS FOR MAKING SAME USING ELECTROLYTE SOLUTIONS HAVING LOW CHLORIDE ION CONCENTRATIONS | GOULD, INC. (US) | 1991-12-12 | — | — | WO | claimed |
| US-4975159-A | Copper salt, inorganic acid and alkoxylated lactam; reinforcing electroconductivity of printed circuit | SCHERING AKTIENGESELLSCHAFT (DE) | 1990-12-04 | — | — | US | claimed |
| EP-0297306-A1 | Aqueous acid bath for the galvanic deposition of brightening and leveling copper coatings | SCHERING AKTIENGESELLSCHAFT (DE) | 1989-01-04 | — | — | EP | claimed |