SCHEMBL211369

SCHEMBL211369

O=S(=O)(O)CCCSSCCCS(=O)(=O)O.[NaH].[NaH]

nearest known ligand 0.48

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.48
PTGS1 P23219 1/20 0.39
PDE4A P27815 1/20 0.39
LMNA P02545 1/20 0.39
SLC6A6 P31641 1/20 0.39
CYP2C19 P33261 1/20 0.39
BLM P54132 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1646543 1.00 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL929912 1.00 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL1258894 1.00 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL220968 0.97 APP (0.50) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL29387431 0.94 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL21808785 0.94 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL29551768 0.94 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL10484571 0.94 APP (0.48) APPPTGS1PDE4ALMNASLC6A6
Water SCHEMBL5356503 0.92 APP (0.46) APPPTGS1PDE4ALMNASLC6A6
SCHEMBL856905 0.92 APP (0.46) APPPTGS1PDE4ALMNASLC6A6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 918 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4746079-A1 SECONDARY BATTERY AND PREPARATION METHOD THEREFOR, AND ELECTRIC DEVICE Contemporary Amperex Technology Co., Limited (CN) 2026-05-20 EP claimed
EP-4723250-A1 CURRENT COLLECTOR, ELECTRODE SHEET, SECONDARY BATTERY, ELECTRIC DEVICE, COPPER FOIL, AND PREPARATION METHOD FOR COPPER FOIL Contemporary Amperex Technology Co., Limited (CN) 2026-04-08 EP claimed
EP-4703500-A1 TRIVALENT CHROMIUM PLATING BATH Dr.-Ing. Max Schlötter GmbH & Co. KG (DE) 2026-03-04 EP claimed
US-12467155-B2 Copper plating solution and negative electrode composite current collector prepared using same CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED (CN) 2025-11-11 US claimed
EP-4611156-A1 COMPOSITE SEPARATOR, SECONDARY BATTERY, AND ELECTRICAL APPARATUS Contemporary Amperex Technology (Hong Kong) Limited (HK) 2025-09-03 EP claimed
US-20250129501-A1 COPPER FOIL WITH HIGH ELONGATION RATE AND METHOD OF MANUFACTURING SAME DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY-ACADEMY COOPERATION (KR) 2025-04-24 US claimed
EP-4194589-B1 COPPER PLATING SOLUTION AND NEGATIVE ELECTRODE COMPOSITE CURRENT COLLECTOR PREPARED USING SAME CONTEMPORARY AMPEREX TECHNOLOGY CO LTD (CN) 2024-09-18 EP claimed
US-20240141532-A1 COPPER PLATING SOLUTION AND NEGATIVE ELECTRODE COMPOSITE CURRENT COLLECTOR PREPARED USING SAME CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED (CN) 2024-05-02 US claimed
US-11932959-B2 Copper plating solution and negative electrode composite current collector prepared using same CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED (CN) 2024-03-19 US claimed
WO-2023219264-A1 METHOD FOR MANUFACTURING ELECTROLYTIC COPPER FOIL 고려아연 주식회사 2023-11-16 WO claimed
US-20060234855-A1 Preparation of solid oxide fuel cell electrodes by electrodeposition OFFICE OF NAVAL RESEARCH 2006-10-19 US claimed
US-20060134902-A1 Method for constructing contact formations INTEL CORPORATION 2006-06-22 US claimed
WO-2006044313-A2 PREPARATION OF SOLID OXIDE FUEL CELL ELECTRODES BY ELECTRODEPOSITION THE TRUSTREES OF THE UNIVERSITY OF PENNSYLVANIA (US) 2006-04-27 WO claimed
US-6755957-B2 FORMING COPPER FILM ON INSULATION LAYER; IMMERSION IN SOLUTION OF PLATING PROMOTER; REMOVING PROMOTER FROM COPPER FILM LEAVING IT ON SIDE WALLS AND BOTTOMS OF VIA HOLES; ELECTROPLATING TO FILL HOLES; IMPROVEMENT OVER PLANARIZATION SHINKO ELECTRIC INDUSTRIES CO., LTD. (JP) 2004-06-29 US claimed
WO-2004053455-A2 PLATING BATH COMPOSITION CONTROL ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2004-06-24 WO claimed
US-20040108213-A1 Analyzing; determination by-product concentration; calibration; circulati ADVANCED TECHNOLOGY MATERIALS, INC. 2004-06-10 US claimed
US-20010013472-A1 Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization SHINKO ELECTRIC INDUSTRIES CO., LTD. (JP) 2001-08-16 US claimed
EP-1122989-A2 Method of plating for filling via holes SHINKO ELECTRIC INDUSTRIES CO. LTD. (JP) 2001-08-08 EP claimed
EP-0058044-B1 ELECTRODEPOSITION OF CHROMIUM W. CANNING MATERIALS LIMITED (GB) 1986-06-18 EP claimed
EP-0058044-A1 Electrodeposition of chromium W. CANNING MATERIALS LIMITED (GB) 1982-08-18 EP claimed