SCHEMBL1746593

SCHEMBL1746593

c1ccc2cc3n[nH]nc3cc2c1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.60
NQO2 P16083 1/20 0.55
DYRK1A Q13627 3/20 0.48
MAPK13 O15264 1/20 0.48
CDK1 P06493 1/20 0.48
PIM1 P11309 1/20 0.48
PIM3 Q86V86 1/20 0.48
CLK4 Q9HAZ1 1/20 0.48
ALDH1A1 P00352 4/20 0.46
KDM4E B2RXH2 4/20 0.46
HPGD P15428 3/20 0.46
F7 P08709 1/20 0.46
F3 P13726 1/20 0.46
GLA P06280 2/20 0.43
MAPT P10636 2/20 0.43
ACHE P22303 1/20 0.43
LMNA P02545 2/20 0.43
MAPK8 P45983 1/20 0.42
MAPK9 P45984 1/20 0.42
MAPK10 P53779 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13156487 0.76 NQO2 (0.88) NQO2ALDH1A1KDM4EHPGDGLA
Benzotriazole SCHEMBL29355833 0.76 TSHR (1.00) TSHRNQO2DYRK1AMAPK13CDK1
Benzotriazole SCHEMBL171464 0.76
SCHEMBL23073578 0.74 ALDH1A1 (0.56) TSHRDYRK1AALDH1A1HPGDF7
Benzotriazole SCHEMBL28497952 0.73 TSHR (0.93) TSHRNQO2DYRK1AMAPK13CDK1
Benzotriazole SCHEMBL29459593 0.73 TSHR (0.93) TSHRNQO2DYRK1AMAPK13CDK1
SCHEMBL2247546 0.71 NQO2 (0.68) NQO2ALDH1A1KDM4EHPGDGLA
SCHEMBL11688588 0.71 NQO2 (0.68) NQO2ALDH1A1KDM4EHPGDGLA
Benzo[B]Phenazine SCHEMBL5481172 0.71 NQO2 (1.00) NQO2ALDH1A1KDM4EHPGDGLA
SCHEMBL3139308 0.69 NQO2 (0.57) NQO2ALDH1A1KDM4EHPGDGLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1255797-B2 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES OMG ELECTRONIC CHEMICALS INC (US) 2016-10-12 EP claimed
EP-1255797-B1 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES OMG ELECTRONIC CHEMICALS INC (US) 2012-06-13 EP claimed
JP-4754752-B2 2011-08-24 JP claimed
EP-1255797-A4 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES ELECTROCHEMICALS INC (US) 2009-01-14 EP claimed
CN-1451031-A Method for roughening copper surfaces for bonding to substrates ELECTROCHEMICALS INC (US) 2003-10-22 CN claimed
JP-2003519286-A 2003-06-17 JP claimed
EP-1255797-A1 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES ELECTROCHEMICALS INC. (US) 2002-11-13 EP claimed
WO-2001049805-A1 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES ELECTROCHEMICALS INC. (US) 2001-07-12 WO claimed
US-11732138-B2 Deep ultraviolet-excitable water-solvated polymeric dyes BECTON, DICKINSON AND COMPANY (US) 2023-08-22 US disclosed
EP-1255797-B2 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES OMG ELECTRONIC CHEMICALS INC (US) 2016-10-12 EP disclosed
EP-1255797-B1 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES OMG ELECTRONIC CHEMICALS INC (US) 2012-06-13 EP disclosed
US-7563315-B2 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates OMG Electronic Chemicals, Inc. (US) 2009-07-21 US disclosed
EP-1255797-A4 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES ELECTROCHEMICALS INC (US) 2009-01-14 EP disclosed
US-7351353-B1 Method for roughening copper surfaces for bonding to substrates ELECTROCHEMICALS, INC. (US) 2008-04-01 US disclosed
US-6716281-B2 ADHESION PROMOTER COMPREISING OXIDIZER, PH ADJUSTER, TOPOGRAPHY MODIFIER; AND COATING STABILIZER COMPRISING 2-MERCAPTOTHIAZOLINE OR 2-MERCAPTOIMIDAZOLINE DERIVATIVE ELECTROCHEMICALS, INC. 2004-04-06 US disclosed
US-20040048486-A1 Method for roughening copper surfaces for bonding to substrates BERNARDS ROGER (US) 2004-03-11 US disclosed
US-20030213553-A1 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates MACDERMID, INCORPORATED 2003-11-20 US disclosed
EP-1255797-A1 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES ELECTROCHEMICALS INC. (US) 2002-11-13 EP disclosed
US-20020084441-A1 Method for roughening copper surfaces for bonding to substrates MACDERMID, INCORPORATED 2002-07-04 US disclosed
WO-2001049805-A1 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES ELECTROCHEMICALS INC. (US) 2001-07-12 WO disclosed