SCHEMBL1747656

SCHEMBL1747656

Cc1[nH]c(Cc2ccccc2)nc1-c1ccc(Cl)cc1Cl

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CRHR1 P34998 3/20 0.44
CXCR2 P25025 2/20 0.44
ALDH1A1 P00352 1/20 0.44
GAA P10253 1/20 0.44
HPGD P15428 1/20 0.44
GUSB P08236 1/20 0.44
CNR1 P21554 3/20 0.44
EGFR P00533 2/20 0.43
ERBB2 P04626 1/20 0.42
PRNP P04156 1/20 0.42
MAPT P10636 1/20 0.42
CCNE2 O96020 2/20 0.42
CDK4 P11802 2/20 0.42
CCND1 P24385 2/20 0.42
CCNE1 P24864 2/20 0.42
CDK2 P24941 2/20 0.42
CCNB2 O95067 1/20 0.42
CDK1 P06493 1/20 0.42
CCNB1 P14635 1/20 0.42
CCNB3 Q8WWL7 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31305532 1.00 CRHR1 (0.44) CRHR1CXCR2ALDH1A1GAAHPGD
SCHEMBL29889804 0.92 PRNP (0.44) CRHR1CXCR2CNR1EGFRERBB2
SCHEMBL2870075 0.92 PRNP (0.44) CRHR1CXCR2CNR1EGFRERBB2
SCHEMBL31305394 0.91 CXCR2 (0.44) CRHR1CXCR2CNR1EGFRERBB2
SCHEMBL2865706 0.91 CXCR2 (0.44) CRHR1CXCR2CNR1EGFRERBB2
SCHEMBL26112642 0.89 DPP4 (0.44) CRHR1CXCR2ALDH1A1CNR1EGFR
SCHEMBL2867413 0.89 CXCR2 (0.44) CXCR2GAAEGFRERBB2PRNP
SCHEMBL28398017 0.88 CDC7 (0.44) CRHR1EGFRERBB2CCNE2CDK4
SCHEMBL28813824 0.88 CRHR1 (0.40) CRHR1EGFRERBB2DPP4
SCHEMBL26112057 0.87 CRHR1 (0.41) CRHR1GUSBCNR1EGFRERBB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111922553-A Copper surface protective agent for advanced wafer packaging field and preparation method thereof 深圳市创智成功科技有限公司 2020-11-13 CN claimed
CN-107971655-B High-heat-resistance organic solder flux and application thereof 永星化工(上海)有限公司 2019-12-27 CN claimed
WO-2010041614-A1 2-BENZYL-4-(2,4-DICHLOROPHENYL)-5-METHYLIMIDAZOLE COMPOUND SHIKOKU CHEMICALS CORPORATION (JP) 2010-04-15 WO claimed
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
CN-111922553-A Copper surface protective agent for advanced wafer packaging field and preparation method thereof 深圳市创智成功科技有限公司 2020-11-13 CN disclosed
CN-107971655-B High-heat-resistance organic solder flux and application thereof 永星化工(上海)有限公司 2019-12-27 CN disclosed
CN-102119240-B Surface treating agent for copper or copper alloy and use thereof SHIKOKU CHEM 2014-07-30 CN disclosed
JP-5368241-B2 2013-12-18 JP disclosed
CN-102171382-B 2-benzyl-4-(2,4-dichlorophenyl)-5-methylimidazole compound SHIKOKU CHEM 2013-08-14 CN disclosed
CN-102171382-A 2-benzyl-4-(2,4-dichlorophenyl)-5-methylimidazole compound SHIKOKU CHEM 2011-08-31 CN disclosed
CN-102171382-A 2-benzyl-4-(2,4-dichlorophenyl)-5-methylimidazole compound SHIKOKU CHEM 2011-08-31 CN disclosed
JP-2011016785-A 2-BENZYL-4-(2,4-DICHLOROPHENYL)-5-METHYLIMIDAZOLE COMPOUND SHIKOKU CHEM CORP 2011-01-27 JP disclosed
JP-2011016785-A 2-BENZYL-4-(2,4-DICHLOROPHENYL)-5-METHYLIMIDAZOLE COMPOUND SHIKOKU CHEM CORP 2011-01-27 JP disclosed
WO-2010041614-A1 2-BENZYL-4-(2,4-DICHLOROPHENYL)-5-METHYLIMIDAZOLE COMPOUND SHIKOKU CHEMICALS CORPORATION (JP) 2010-04-15 WO disclosed
WO-2010041614-A1 2-BENZYL-4-(2,4-DICHLOROPHENYL)-5-METHYLIMIDAZOLE COMPOUND SHIKOKU CHEMICALS CORPORATION (JP) 2010-04-15 WO disclosed
WO-2010041614-A1 2-BENZYL-4-(2,4-DICHLOROPHENYL)-5-METHYLIMIDAZOLE COMPOUND SHIKOKU CHEMICALS CORPORATION (JP) 2010-04-15 WO disclosed
WO-2010016620-A1 SURFACE TREATING AGENT FOR COPPER OR COPPER ALLOY AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-11 WO disclosed
WO-2010016620-A1 SURFACE TREATING AGENT FOR COPPER OR COPPER ALLOY AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-11 WO disclosed