SCHEMBL17480253

SCHEMBL17480253

Cc1cc(C(C)(CCCO)c2ccc(O)c(C)c2)ccc1O

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 17/20 0.55
ESR2 Q92731 6/20 0.54
AR P10275 3/20 0.53
CNR1 P21554 2/20 0.48
CNR2 P34972 2/20 0.48
CHEK1 O14757 1/20 0.43
FYN P06241 1/20 0.43
PDGFRB P09619 1/20 0.43
PIM1 P11309 1/20 0.43
FGFR1 P11362 1/20 0.43
FLT1 P17948 1/20 0.43
GRK5 P34947 1/20 0.43
MAP2K2 P36507 1/20 0.43
MAPK8 P45983 1/20 0.43
CDK8 P49336 1/20 0.43
RPS6KA3 P51812 1/20 0.43
PRKX P51817 1/20 0.43
JAK3 P52333 1/20 0.43
LIMK1 P53667 1/20 0.43
BTK Q06187 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17483505 0.95 ESR1 (0.50) ESR1ESR2ARCNR1CNR2
SCHEMBL17485288 0.94 ESR1 (0.53) ESR1ESR2ARCNR1CNR2
SCHEMBL18473462 0.91 ESR1 (0.46) ESR1ESR2ARCNR1CNR2
SCHEMBL2028816 0.86 ESR1 (0.74) ESR1ESR2AR
SCHEMBL2413116 0.84 ESR1 (0.57) ESR1ESR2AR
SCHEMBL31738904 0.84 ESR1 (0.67) ESR1ESR2ARCNR1CNR2
SCHEMBL6056720 0.84 ESR1 (0.67) ESR1ESR2ARCNR1CNR2
SCHEMBL2860135 0.83 ESR1 (0.65) ESR1ESR2ARCNR1CNR2
SCHEMBL2857428 0.83 ESR1 (0.65) ESR1ESR2ARCNR1CNR2
SCHEMBL10748415 0.83 ESR1 (0.65) ESR1ESR2ARCNR1CNR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10197914-B2 Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-02-05 US disclosed
US-20170255097-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING THE SAME, PATTERNING PROCESS, AND LAMINATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-09-07 US disclosed
US-20170255097-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING THE SAME, PATTERNING PROCESS, AND LAMINATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-09-07 US disclosed
EP-2980172-B1 SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM SHINETSU CHEMICAL CO (JP) 2016-11-02 EP disclosed
US-20160200877-A1 SILICONE SKELETON-CONTAINING POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, SUBSTRATE, AND SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-07-14 US disclosed
US-20160200877-A1 SILICONE SKELETON-CONTAINING POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, SUBSTRATE, AND SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-07-14 US disclosed
US-9377689-B2 Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-06-28 US disclosed
US-9377689-B2 Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-06-28 US disclosed
US-20160097973-A1 SILICONE SKELETON-CONTAINING POLYMER COMPOUND AND METHOD FOR PRODUCING SAME, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, AND SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-04-07 US disclosed
US-20160097973-A1 SILICONE SKELETON-CONTAINING POLYMER COMPOUND AND METHOD FOR PRODUCING SAME, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, AND SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-04-07 US disclosed
US-20160033865-A1 SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-02-04 US disclosed
US-20160033865-A1 SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-02-04 US disclosed
EP-2980172-A1 SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM Shin-Etsu Chemical Co., Ltd. (JP) 2016-02-03 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20160033865-A1 SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM SMC4, SMC3, PUF60 ESR1 206/4885ESR2 334/4885AR 2482/4885
US-10197914-B2 Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate SUV39H1, JMJD6, EZH1 ESR1 1793/4885ESR2 3341/4885AR 4062/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.