SCHEMBL17508265

SCHEMBL17508265

Nc1cccc(Oc2cccc(O)c2)c1

nearest known ligand 0.69

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 2/20 0.67
ALDH1A1 P00352 6/20 0.64
CA12 O43570 2/20 0.64
CA2 P00918 2/20 0.64
CA9 Q16790 2/20 0.64
CA14 Q9ULX7 2/20 0.64
CA1 P00915 1/20 0.64
CA7 P43166 1/20 0.64
TDP1 Q9NUW8 1/20 0.64
MAPT P10636 2/20 0.53
POLB P06746 1/20 0.53
HSP90AA1 P07900 1/20 0.53
CYP3A4 P08684 5/20 0.52
SMN1; SMN2 Q16637 2/20 0.52
MEN1 O00255 1/20 0.52
MITF O75030 1/20 0.52
GAA P10253 1/20 0.52
GFER P55789 1/20 0.52
KMT2A Q03164 1/20 0.52
NLRP1 Q9C000 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30833245 1.00 MAOB (0.67) MAOBALDH1A1CA12CA2CA9
Resorcinol SCHEMBL26103063 0.96 MAOB (0.67) MAOBALDH1A1CA12CA2CA9
SCHEMBL3947081 0.90 MAOB (0.53) MAOBALDH1A1CA12CA2CA9
SCHEMBL29414092 0.87 MAOB (0.86) MAOBALDH1A1MAPTPOLBHSP90AA1
SCHEMBL55303 0.87 MAOB (0.86) MAOBALDH1A1MAPTPOLBHSP90AA1
SCHEMBL813557 0.87 CYP3A4 (0.58) ALDH1A1CA12CA2CA9CA14
SCHEMBL30107929 0.87 MAOB (0.86) MAOBALDH1A1MAPTPOLBHSP90AA1
SCHEMBL30358272 0.87 CYP3A4 (0.58) ALDH1A1CA12CA2CA9CA14
SCHEMBL2428939 0.86 ALDH1A1 (0.73) MAOBALDH1A1CA12CA2CA9
SCHEMBL1362217 0.86 MAOB (0.70) MAOBALDH1A1CA12CA2CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118255988-A Polyimide molded article and method for producing same 聚酰亚胺先端材料有限公司 2024-06-28 CN claimed
CN-112955497-B Ultrathin polyimide film with improved dimensional stability and preparation method thereof 聚酰亚胺先端材料有限公司 2023-07-11 CN claimed
CN-116333674-A PI adhesive, PI film and warping-resistant FCCL product prepared from PI adhesive and PI film 广州方邦电子股份有限公司 2023-06-27 CN claimed
CN-112955497-A Ultrathin polyimide film with improved dimensional stability and preparation method thereof 聚酰亚胺先端材料有限公司 2021-06-11 CN claimed
WO-2016020112-A1 OXIDATION DYE PRECURSOR HENKEL AG & CO. KGAA (DE) 2016-02-11 WO claimed
EP-4157844-B1 4-(7H-PYRROLO[2,3-D]PYRIMIDIN-4-YL)-3,6-DIHYDROPYRIDINE-1-(2H)-CARBOXAMIDE DERIVATIVES AS LIMK AND/OR ROCK KINASES INHIBITORS FOR USE IN THE TREATMENT OF CANCER CENTRE NAT RECH SCIENT (FR) 2024-07-10 EP disclosed
CN-114072451-B Polyamic acid composition, method for preparing the same, and polyimide containing the same PI尖端素材株式会社 2024-07-02 CN disclosed
CN-118255988-A Polyimide molded article and method for producing same 聚酰亚胺先端材料有限公司 2024-06-28 CN disclosed
CN-118234784-A Polyimide film for graphite sheet and graphite sheet produced therefrom 聚酰亚胺先端材料有限公司 2024-06-21 CN disclosed
CN-118159599-A Polyamic acid composition and preparation method thereof PI尖端素材株式会社 2024-06-07 CN disclosed
CN-118159600-A Polyamic acid composition and preparation method thereof PI尖端素材株式会社 2024-06-07 CN disclosed
CN-117916321-A Polyamic acid composition and polyimide prepared from same PI尖端素材株式会社 2024-04-19 CN disclosed
CN-105164585-B Laminated structure, flexible printed circuit board, and method for manufacturing same 太阳油墨制造株式会社 2020-02-21 CN disclosed
CN-105378564-B Photosensitive thermosetting resin composition and flexible printed circuit board 太阳油墨制造株式会社 2020-02-07 CN disclosed
WO-2020009016-A1 METHOD FOR PRODUCING ORGANIC COMPOUND ユニチカ株式会社 2020-01-09 WO disclosed
CN-107698761-A A kind of preparation method of polyimides 杭州超通科技有限公司 2018-02-16 CN disclosed
CN-104769021-B Flexible device substrate, flexible device and its manufacture method, laminate and its manufacture method and resin combination 旭化成株式会社 2017-10-10 CN disclosed
WO-2016020112-A1 OXIDATION DYE PRECURSOR HENKEL AG & CO. KGAA (DE) 2016-02-11 WO disclosed
WO-2016020112-A1 OXIDATION DYE PRECURSOR HENKEL AG & CO. KGAA (DE) 2016-02-11 WO disclosed
CN-104769021-A Substrate for flexible device, flexible device and method for producing same, laminate and method for producing same, and resin composition ASAHI KASEI E MATERIALS CORP 2015-07-08 CN disclosed