⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5699135 | 0.69 | — | — | |
| SCHEMBL866265 | 0.67 | ALDH1A1 (0.31) | — | |
| SCHEMBL4640839 | 0.67 | — | — | |
| SCHEMBL5699093 | 0.66 | — | — | |
| SCHEMBL893505 | 0.65 | — | — | |
| SCHEMBL6281502 | 0.65 | — | — | |
| SCHEMBL893217 | 0.64 | — | — | |
| SCHEMBL15854411 | 0.63 | ALDH1A1 (0.31) | — | |
| SCHEMBL7211700 | 0.62 | — | — | |
| SCHEMBL29452 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12122929-B2 | Copolymers of perfluorocycloaliphatic methyl vinyl ether | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2024-10-22 | — | — | US | disclosed |
| CN-113056492-B | Copolymers of perfluoroalicyclic methyl vinyl ethers | 3M创新有限公司 | 2023-01-06 | — | — | CN | disclosed |
| US-20220033673-A1 | COPOLYMERS OF PERFLUOROCYCLOALIPHATIC METHYL VINYL ETHER | 3M INNOVATIVE PROPERTIES COMPANY | 2022-02-03 | — | — | US | disclosed |
| CN-113056492-A | Copolymers of perfluoroalicyclic methyl vinyl ethers | 3M创新有限公司 | 2021-06-29 | — | — | CN | disclosed |
| WO-2020102271-A2 | COPOLYMERS OF PERFLUOROCYCLOALIPHATIC METHYL VINYL ETHER | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2020-05-22 | — | — | WO | disclosed |
| CN-105143977-B | Method for producing substrate having concave pattern, composition, method for forming conductive film, electronic circuit, and electronic device | JSR株式会社 | 2020-01-07 | — | — | CN | disclosed |
| US-9980392-B2 | Process for producing substrate having wiring, radiation-sensitive composition, electronic circuit and electronic device | JSR CORPORATION (JP) | 2018-05-22 | — | — | US | disclosed |
| US-9746775-B2 | Method for manufacturing substrate having concave pattern, composition, method for forming conductive film, electronic circuit and electronic device | JSR CORPORATION (JP) | 2017-08-29 | — | — | US | disclosed |
| US-20170042038-A1 | PROCESS FOR PRODUCING SUBSTRATE HAVING WIRING, RADIATION-SENSITIVE COMPOSITION, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE | JSR CORPORATION (JP) | 2017-02-09 | — | — | US | disclosed |
| EP-2993519-A1 | METHOD FOR MANUFACTURING BASE MATERIAL HAVING RECESSED PATTERN, COMPOSITION, METHOD FOR FORMING ELECTRICALLY CONDUCTIVE FILM, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE | JSR Corporation (JP) | 2016-03-09 | — | — | EP | disclosed |
| US-20160062242-A1 | METHOD FOR MANUFACTURING SUBSTRATE HAVING CONCAVE PATTERN, COMPOSITION, METHOD FOR FORMING CONDUCTIVE FILM, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE | JSR CORPORATION (JP) | 2016-03-03 | — | — | US | disclosed |
| CN-105143977-A | Method for producing substrate having concave pattern, composition, method for forming conductive film, electronic circuit, and electronic device | JSR CORP | 2015-12-09 | — | — | CN | disclosed |