⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1137844 | 0.98 | — | — | |
| SCHEMBL3684969 | 0.80 | — | — | |
| SCHEMBL1470653 | 0.76 | — | — | |
| SCHEMBL28537855 | 0.76 | — | — | |
| SCHEMBL135560 | 0.76 | — | — | |
| SCHEMBL1223952 | 0.76 | CYP2D6 (0.36) | — | |
| SCHEMBL1248810 | 0.75 | — | — | |
| SCHEMBL728666 | 0.75 | — | — | |
| SCHEMBL1459065 | 0.74 | — | — | |
| SCHEMBL28035997 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8293001-B2 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-10-23 | — | — | US | disclosed |
| US-20110143032-A1 | Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films With Low Dielectric Constants | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2011-06-16 | — | — | US | disclosed |
| US-7943195-B2 | Mixing of glass with hydrocarbons; chemical vapor deposition; mixing organosilane and/or organosiloxane precursors with porogens; neohexyl-1,3,5,7-tetramethylcyclo-tetrasiloxane | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2011-05-17 | — | — | US | disclosed |
| US-20080271640-A1 | Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2008-11-06 | — | — | US | disclosed |
| US-7384471-B2 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2008-06-10 | — | — | US | disclosed |
| US-6846515-B2 | Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2005-01-25 | — | — | US | disclosed |
| US-20030232137-A1 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | VERSUM MATERIALS US, LLC | 2003-12-18 | — | — | US | disclosed |
| US-20030198742-A1 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | VERSUM MATERIALS US, LLC | 2003-10-23 | — | — | US | disclosed |
| EP-1354980-A1 | Method for forming a porous SiOCH layer. | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2003-10-22 | — | — | EP | disclosed |