Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ABL1 | P00519 | 2/20 | 0.54 |
| ▸ | ABCB1 | P08183 | 2/20 | 0.54 |
| ▸ | BCR | P11274 | 2/20 | 0.54 |
| ▸ | ESR2 | Q92731 | 5/20 | 0.48 |
| ▸ | BCL2L1 | Q07817 | 2/20 | 0.48 |
| ▸ | MMP3 | P08254 | 1/20 | 0.48 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.44 |
| ▸ | BACE1 | P56817 | 1/20 | 0.44 |
| ▸ | ESR1 | P03372 | 6/20 | 0.43 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.40 |
| ▸ | MEN1 | O00255 | 2/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.40 |
| ▸ | NPC1 | O15118 | 1/20 | 0.40 |
| ▸ | HPGDS | O60760 | 1/20 | 0.40 |
| ▸ | MAPT | P10636 | 1/20 | 0.40 |
| ▸ | PKM | P14618 | 1/20 | 0.40 |
| ▸ | MAOB | P27338 | 1/20 | 0.40 |
| ▸ | RAB9A | P51151 | 1/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3264500 | 0.83 | ABL1 (0.50) | ABL1ABCB1BCRESR2BCL2L1 | |
| SCHEMBL1513629 | 0.83 | CA1 (0.56) | ABL1ABCB1BCRESR2BCL2L1 | |
| SCHEMBL9513577 | 0.81 | ABL1 (0.48) | ABL1ABCB1BCRESR2BCL2L1 | |
| SCHEMBL1649339 | 0.80 | ABL1 (0.76) | ABL1ABCB1BCRESR2BCL2L1 | |
| SCHEMBL4432976 | 0.80 | ABL1 (0.76) | ABL1ABCB1BCRESR2BCL2L1 | |
| SCHEMBL9399245 | 0.79 | ABL1 (0.47) | ABL1ABCB1BCRESR2BCL2L1 | |
| SCHEMBL28292946 | 0.79 | ABL1 (0.47) | ABL1ABCB1BCRESR2BCL2L1 | |
| SCHEMBL28743249 | 0.78 | ABL1 (0.46) | ABL1ABCB1BCRESR2BCL2L1 | |
| SCHEMBL8120374 | 0.78 | ABL1 (0.46) | ABL1ABCB1BCRESR2BCL2L1 | |
| SCHEMBL1885427 | 0.78 | ABL1 (0.73) | ABL1ABCB1BCRESR2BCL2L1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023091578-A1 | LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE UPON EXPOSURE TO LASER ENERGY | HENKEL AG & CO. KGAA (DE) | 2023-05-25 | — | — | WO | disclosed |
| US-20210163674-A1 | LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS | Henkel IP & Holding GmbH (DE) | 2021-06-03 | — | — | US | disclosed |
| US-10851201-B2 | Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering | HUNTSMAN INTERNATIONAL LLC (US) | 2020-12-01 | — | — | US | disclosed |
| CN-107636039-B | Curing agent for thermosetting epoxy resins and method for producing insulation systems for electronic engineering | 亨斯迈先进材料许可(瑞士)有限公司 | 2020-11-24 | — | — | CN | disclosed |
| EP-3298061-B1 | A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING | HUNTSMAN ADVANCED MAT LICENSING (SWITZERLAND) GMBH (CH) | 2020-09-09 | — | — | EP | disclosed |
| US-20180142058-A1 | A Curing Agent For Thermosetting Epoxy Resins, and a Process for the Preparation of Insulation Systems for Electrical Engineering | HUNTSMAN INTERNATIONAL LLC (US) | 2018-05-24 | — | — | US | disclosed |
| EP-2489689-B1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | NIPPON SODA CO (JP) | 2017-05-10 | — | — | EP | disclosed |
| EP-1767090-B1 | CLATHRATE COMPOUND, METHOD OF CONTROLLING CONCENTRATION OF AQUEOUS SOLUTION OF AGRICULTURAL-CHEMICAL ACTIVE INGREDIENT, AND AGRICULTURAL-CHEMICAL PREPARATION | NIPPON SODA CO (JP) | 2015-08-12 | — | — | EP | disclosed |
| US-9068074-B2 | Composition for formation of cured epoxy resin, and cured products thereof | NIPPON SODA CO., LTD. (JP) | 2015-06-30 | — | — | US | disclosed |
| EP-2573148-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | Nippon Soda Co., Ltd. (JP) | 2013-03-27 | — | — | EP | disclosed |
| EP-1520867-A2 | Curatives for epoxy resin, curing accelerator, and epoxy resin composition | NIPPON SODA CO., LTD. (JP) | 2005-04-06 | — | — | EP | disclosed |
| EP-0949286-B1 | CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION | NIPPON SODA CO (JP) | 2005-03-02 | — | — | EP | disclosed |
| US-20040106764-A1 | Curatives for epoxy resin, curing accelerator, and epoxy resin composition | SUZUKI HIROSHI (JP) | 2004-06-03 | — | — | US | disclosed |
| US-6727325-B1 | HEAT RESISTANCE, STABILITY, POT LIFE; ONE-PACK MIXTURES; LOW TEMPERATURE CURABILITY | NIPPON SODA CO. LTD. (JP) | 2004-04-27 | — | — | US | disclosed |
| US-6147169-A | LOW TEMPERATURE CURING MIXTURE OF REACTIVE BASE RESIN AND A CLATHRATE COMPRISING A TETRAKISPHENOL HOSTING A CURING AGENT OR CURING CATALYST; STORAGE STABILITY, CORROSION RESISTANCE, ADHESION | KANSAI PAINT CO., LTD. (JP) | 2000-11-14 | — | — | US | disclosed |
| EP-0709358-B1 | NOVEL CLATHRATE COMPOUND, PROCESS FOR PRODUCING THE SAME, AND ANTIFOULING AGENT | NIPPON SODA CO (JP) | 1999-10-13 | — | — | EP | disclosed |
| EP-0949286-A1 | CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION | NIPPON SODA CO., LTD. (JP) | 1999-10-13 | — | — | EP | disclosed |
| EP-0709358-A1 | NOVEL CLATHRATE COMPOUND, PROCESS FOR PRODUCING THE SAME, AND ANTIFOULING AGENT | NIPPON SODA CO., LTD. (JP) | 1996-05-01 | — | — | EP | disclosed |
| US-5364977-A | Chemical stabilization and powder processing | NIPPON SODA CO., LTD. (JP) | 1994-11-15 | — | — | US | disclosed |
| EP-0589044-A1 | NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST | NIPPON SODA CO., LTD. (JP) | 1994-03-30 | — | — | EP | disclosed |