Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.62 |
| ▸ | LIMK2 | P53671 | 1/20 | 0.62 |
| ▸ | BRD4 | O60885 | 2/20 | 0.59 |
| ▸ | ESR1 | P03372 | 1/20 | 0.57 |
| ▸ | PDE6D | O43924 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.48 |
| ▸ | MEN1 | O00255 | 1/20 | 0.48 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.48 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.48 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.48 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.48 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.48 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.48 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.47 |
| ▸ | LMNA | P02545 | 2/20 | 0.47 |
| ▸ | HPGD | P15428 | 1/20 | 0.47 |
| ▸ | HTT | P42858 | 1/20 | 0.47 |
| ▸ | PLAA | Q9Y263 | 1/20 | 0.47 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Iodide SCHEMBL28519464 | 0.98 | HSD17B10 (0.60) | HSD17B10LIMK2BRD4ESR1PDE6D | |
| Fluoride SCHEMBL10339918 | 0.98 | HSD17B10 (0.60) | HSD17B10LIMK2BRD4ESR1PDE6D | |
| Bromide SCHEMBL811908 | 0.98 | HSD17B10 (0.60) | HSD17B10LIMK2BRD4ESR1PDE6D | |
| Hydrochloric Acid SCHEMBL233781 | 0.98 | HSD17B10 (0.60) | HSD17B10LIMK2BRD4ESR1PDE6D | |
| Fluoride Ion SCHEMBL10906965 | 0.96 | LIMK2 (0.59) | HSD17B10LIMK2BRD4ESR1PDE6D | |
| SCHEMBL5981532 | 0.96 | LIMK2 (0.63) | HSD17B10LIMK2BRD4ESR1PDE6D | |
| Fluoride SCHEMBL10906966 | 0.96 | LIMK2 (0.59) | HSD17B10LIMK2BRD4ESR1PDE6D | |
| Bromide SCHEMBL811907 | 0.96 | LIMK2 (0.59) | HSD17B10LIMK2BRD4ESR1PDE6D | |
| SCHEMBL10906967 | 0.93 | LIMK2 (0.56) | HSD17B10LIMK2BRD4ESR1PDE6D | |
| SCHEMBL2840217 | 0.91 | LIMK2 (0.58) | HSD17B10LIMK2BRD4ESR1PDE6D |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 5302 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122051120-A | Preparation method of petroleum coke-resin-based hard carbon composite anode material, sodium ion battery and application of sodium ion battery | 天宏基科技(深圳)有限公司 | 2026-05-15 | — | — | CN | claimed |
| US-20250333594-A1 | RESIN COMPOSITION | NAN YA PLASTICS CORPORATION (TW) | 2025-10-30 | — | — | US | claimed |
| US-20250188268-A1 | SHEET MOLDING COMPOUND AND FIBER-REINFORCED COMPOSITE MATERIAL | MITSUBISHI CHEMICAL CORPORATION (JP) | 2025-06-12 | — | — | US | claimed |
| US-20250163261-A1 | LOW-DIELECTRIC RESIN COMPOSITION | NAN YA PLASTICS CORPORATION (TW) | 2025-05-22 | — | — | US | claimed |
| CN-120005486-A | Low dielectric resin composition | 南亚塑胶工业股份有限公司 | 2025-05-16 | — | — | CN | claimed |
| CN-119859370-A | Cycloolefin resin composition and composite material thereof | 道生天合材料科技(上海)股份有限公司 | 2025-04-22 | — | — | CN | claimed |
| CN-119371920-A | Single-component epoxy adhesive for magnetic core adhesion | 成都拓利科技股份有限公司 | 2025-01-28 | — | — | CN | claimed |
| CN-119371903-A | High-heat-conductivity composite film and preparation method thereof | 昆山雅森电子材料科技有限公司 | 2025-01-28 | — | — | CN | claimed |
| CN-119119894-A | Metal composite film and lithium ion battery | 上海恩捷新材料科技有限公司 | 2024-12-13 | — | — | CN | claimed |
| WO-2024248496-A1 | ADHESIVE MATERIAL COMPOSITION OF FLEXIBLE SUBSTRATE FOR AUTOMOTIVE ELECTRONIC PARTS | 오컴퍼니 주식회사 | 2024-12-05 | — | — | WO | claimed |
| US-20040171817-A1 | Novel dye complexes and use thereof in imaging members and methods | ZINK HOLDINGS LLC | 2004-09-02 | — | — | US | claimed |
| US-6558812-B2 | Adherent to the surface of silicon flip chips, especially polyimide resins and nitride films; shock resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-06 | — | — | US | claimed |
| US-6534193-B2 | Containing a low molecular weight indene-styrene or indene-chroman-styrene copolymer; semiconductor device sealed with the cured product of the liquid epoxy resin | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-18 | — | — | US | claimed |
| US-20020089071-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-07-11 | — | — | US | claimed |
| US-20020077421-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-06-20 | — | — | US | claimed |
| US-20020045709-A1 | Liquid epoxy resin composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-04-18 | — | — | US | claimed |
| US-5985954-A | POLYDIMETHYLSILOXANE MODIFIED WITH ETHYLENE OXIDE-PROPYLENE OXIDE AND EPOXY RESIN | HTIACHI CHEMICAL COMPANY, LTD. (JP) | 1999-11-16 | — | — | US | claimed |
| US-5179210-A | PREPARATION OF N-SUBSTITUTED IMIDAZOLES | BASF AKTIENGESELLSCHAFT (DE) | 1993-01-12 | — | — | US | claimed |
| EP-0130454-B1 | PROCESS FOR THE PREPARATION OF MOULDING MASSES FROM REACTIVE RESINS | SIEMENS AKTIENGESELLSCHAFT (DE) | 1989-11-08 | — | — | EP | claimed |
| EP-0130454-A2 | Process for the preparation of moulding masses from reactive resins | SIEMENS AKTIENGESELLSCHAFT (DE) | 1985-01-09 | — | — | EP | claimed |