SCHEMBL17652004

SCHEMBL17652004

CCC[C@](O)(CC)C(N)=O

nearest known ligand 0.39

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.39
HSD17B10 Q99714 1/20 0.39
FDPS P14324 2/20 0.36
GAA P10253 2/20 0.35
ALOX12 P18054 1/20 0.35
CYP2C19 P33261 1/20 0.35
ALDH1A1 P00352 3/20 0.31
MEN1 O00255 1/20 0.31
CYP1A2 P05177 1/20 0.31
THRB P10828 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2170581 1.00 LMNA (0.39) LMNAHSD17B10FDPSGAAALOX12
SCHEMBL10787636 0.90 LMNA (0.41) LMNAHSD17B10FDPSGAAALOX12
SCHEMBL3848183 0.84 SCN5A (0.43) FDPSGAA
SCHEMBL1629346 0.84
SCHEMBL6940897 0.82 SCN5A (0.45) FDPS
SCHEMBL31351856 0.82 SCN5A (0.45) FDPS
SCHEMBL22023411 0.82 SCN5A (0.45) FDPS
SCHEMBL21403269 0.82 SCN5A (0.45) FDPS
SCHEMBL1115356 0.82 SCN5A (0.45) FDPS
Hydrochloric Acid SCHEMBL25340342 0.81 ALOX15 (0.33) LMNAALDH1A1MEN1CYP1A2THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250043165-A1 LOW-TEMPERATURE CURING COATING COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2025-02-06 US disclosed
EP-3580290-B1 LOW-TEMPERATURE CURING COATING COMPOSITIONS PPG IND OHIO INC (US) 2024-05-01 EP disclosed
US-11952514-B2 Low-temperature curing adhesive compositions PPG INDUSTRIES OHIO, INC. (US) 2024-04-09 US disclosed
CN-110249013-B Low temperature curing coating composition PPG工业俄亥俄公司 2022-08-30 CN disclosed
CN-110300770-B Low temperature curing adhesive composition PPG工业俄亥俄公司 2022-03-01 CN disclosed
US-10144702-B2 Method for the manufacture of N,N-dialkyllactamide PURAC BIOCHEM B.V. (NL) 2018-12-04 US disclosed
US-20170298009-A1 METHOD FOR THE MANUFACTURE OF N,N-DIALLKYLLACTAMIDE PURAC BIOCHEM BV (NL) 2017-10-19 US disclosed
EP-3201172-A1 METHOD FOR THE MANUFACTURE OF N, N-DIALKYLLACTAMIDE PURAC Biochem BV (NL) 2017-08-09 EP disclosed
WO-2016050894-A1 METHOD FOR THE MANUFACTURE OF N, N-DIALLKYLLACTAMIDE PURAC BIOCHEM BV (NL) 2016-04-07 WO disclosed