Biphenyl

Biphenyl

SCHEMBL17667199

C(OCC1CO1)C1CO1.C1CCC(C2CCCCC2)CC1

nearest known ligand 0.56

Full drug profile on Sugi Atlas →

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.56
SMN1; SMN2 Q16637 2/20 0.48
ALDH1A1 P00352 9/20 0.45
TDP1 Q9NUW8 3/20 0.45
MAPK1 P28482 1/20 0.45
TP53 P04637 2/20 0.44
CYP3A4 P08684 2/20 0.44
HIF1A Q16665 1/20 0.32
GLA P06280 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27130602 0.98 TSHR (0.58) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
Biphenyl SCHEMBL28161303 0.94 TSHR (0.50) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL21633647 0.90 TSHR (0.47) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL961313 0.87 TSHR (0.62) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
Cyclohexane SCHEMBL960269 0.87 TSHR (0.62) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL8044179 0.87 TSHR (0.62) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
Cyclopropane SCHEMBL963062 0.87 TSHR (0.62) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL28515263 0.87 TSHR (0.62) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL5513152 0.84 TSHR (0.54) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
Cyclohexanol SCHEMBL28034283 0.82 TSHR (0.52) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116529281-A Process for producing thermoplastic polyoxazolidone polymers 科思创德国股份有限公司 2023-08-01 CN disclosed
CN-105246940-B Optical semiconductor sealing solidification compound 株式会社大赛璐 2018-09-04 CN disclosed
US-9685597-B2 Curable composition for sealing optical semiconductor DAICEL CORPORATION (JP) 2017-06-20 US disclosed
US-20160126431-A1 CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR DAICEL CORPORATION (JP) 2016-05-05 US disclosed
EP-3006481-A1 CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR Daicel Corporation (JP) 2016-04-13 EP disclosed
CN-105246940-A Curable composition for sealing optical semiconductor DAICEL CORP 2016-01-13 CN disclosed