Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ADORA1 | P30542 | 2/20 | 0.35 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.32 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.31 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.30 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17688 | 0.93 | — | — | |
| SCHEMBL28138740 | 0.93 | ADORA1 (0.38) | ADORA1TP53L3MBTL1DDAH1ADORA3 | |
| Ammonia Solution, Strong SCHEMBL28173798 | 0.91 | — | — | |
| Hydrochloric Acid SCHEMBL27901170 | 0.91 | — | — | |
| SCHEMBL11854680 | 0.91 | — | — | |
| Bromide SCHEMBL8534627 | 0.91 | — | — | |
| SCHEMBL27353369 | 0.91 | — | — | |
| SCHEMBL11333696 | 0.91 | — | — | |
| SCHEMBL2023841 | 0.89 | ADORA1 (0.34) | ADORA1TP53L3MBTL1 | |
| Hydrogen Peroxide SCHEMBL28136903 | 0.89 | ADORA1 (0.36) | ADORA1TP53L3MBTL1DDAH1ADORA3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-102559210-A | Liquid crystal alignment agent, liquid crystal alignment film and liquid crystal display element | CHI MEI CORP | 2012-07-11 | — | — | CN | disclosed |
| US-20120162588-A1 | LIQUID CRYSTAL ALIGNMENT AGENT, AND LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY ELEMENT FORMED FROM THE LIQUID CRYSTAL ALIGNMENT AGENT | CHI MEI CORPORATION (TW) | 2012-06-28 | — | — | US | disclosed |
| US-6713589-B2 | GLASS TRANSITION TEMPERATURE, LOW MOISTURE ABSORPTION, ADHESION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-03-30 | — | — | US | disclosed |
| US-20020065386-A1 | Glass transition temperature, low moisture absorption, adhesion | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-05-30 | — | — | US | disclosed |
| US-6329492-B1 | USEFUL AS MATERIAL FOR ENCAPSULATING ELECTRONIC DEVICES, FOR LAMINATION OR FOR ADHESION; CURING AGENT FOR EPOXY RESINS | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-12-11 | — | — | US | disclosed |