SCHEMBL17835478

SCHEMBL17835478

CCN(CC)c1ccc(-c2sc3ccc(C)cc3[n+]2C)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SNCA P37840 3/20 0.58
APP P05067 2/20 0.58
TNF P01375 1/20 0.58
NOD1 Q9Y239 1/20 0.58
MEN1 O00255 3/20 0.56
KMT2A Q03164 3/20 0.56
BCHE P06276 1/20 0.56
NPC1 O15118 1/20 0.56
POLB P06746 1/20 0.56
RAB9A P51151 1/20 0.56
INSR P06213 2/20 0.44
ACHE P22303 2/20 0.42
KDM4E B2RXH2 2/20 0.41
MAPT P10636 4/20 0.40
RECQL P46063 2/20 0.34
THRB P10828 1/20 0.34
HSP90AA1 P07900 1/20 0.33
KDM1A O60341 1/20 0.33
PSMD14 O00487 1/20 0.33
ALDH1A1 P00352 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL39782 0.99 SNCA (0.59) SNCAAPPTNFNOD1MEN1
SCHEMBL19305181 0.89 SNCA (0.73) SNCAAPPTNFNOD1MEN1
Hydrochloric Acid SCHEMBL39277 0.88 SNCA (0.74) SNCAAPPTNFNOD1MEN1
SCHEMBL19305182 0.85 APP (0.79) SNCAAPPTNFNOD1MEN1
Hydrochloric Acid SCHEMBL39418 0.83 APP (0.80) SNCAAPPTNFNOD1MEN1
SCHEMBL19305187 0.82 SNCA (0.41) SNCAAPPTNFNOD1MEN1
SCHEMBL19305174 0.82 APP (0.44) SNCAAPPTNFNOD1MEN1
Hydrochloric Acid SCHEMBL3410018 0.81 SNCA (0.43) SNCAAPPTNFNOD1MEN1
Hydrochloric Acid SCHEMBL39306 0.81 APP (0.46) SNCAAPPTNFNOD1MEN1
SCHEMBL4625707 0.78 SNCA (0.50) SNCAAPPTNFNOD1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3034654-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-10-25 EP claimed
EP-2241653-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-06 EP claimed
EP-3034654-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-10-25 EP disclosed
EP-3034654-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2016-06-22 EP disclosed