Hydrochloric Acid

Hydrochloric Acid

SCHEMBL39277

CCN(CC)c1ccc(-c2sc3cc(C)ccc3[n+]2C)cc1.[Cl-]

nearest known ligand 0.74

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACHE known ✓ P22303 4/20 0.44
SNCA P37840 4/20 0.74
APP P05067 3/20 0.74
BCHE P06276 3/20 0.74
TNF P01375 1/20 0.71
NOD1 Q9Y239 1/20 0.71
MEN1 O00255 4/20 0.70
KMT2A Q03164 4/20 0.70
NPC1 O15118 2/20 0.70
RAB9A P51151 2/20 0.70
POLB P06746 1/20 0.70
INSR P06213 2/20 0.43
KDM4E B2RXH2 4/20 0.40
LMNA P02545 3/20 0.40
MAPT P10636 3/20 0.40
HSP90AA1 P07900 1/20 0.37
RXFP1 Q9HBX9 1/20 0.36
GPR35 Q9HC97 1/20 0.36
ALDH1A1 P00352 2/20 0.36
HPGD P15428 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19305181 0.99 SNCA (0.73) SNCAAPPBCHETNFNOD1
Hydrochloric Acid SCHEMBL39782 0.90 SNCA (0.59) SNCAAPPBCHETNFNOD1
SCHEMBL17835478 0.88 SNCA (0.58) SNCAAPPBCHETNFNOD1
Hydrochloric Acid SCHEMBL25298 0.85 APP (1.00) SNCAAPPBCHETNFNOD1
SCHEMBL1577265 0.83 APP (1.00) SNCAAPPBCHETNFNOD1
Hydrochloric Acid SCHEMBL39254 0.83 SNCA (0.51) SNCAAPPBCHETNFNOD1
Bromide SCHEMBL144934 0.82 APP (0.97) SNCAAPPBCHETNFNOD1
Hydrochloric Acid SCHEMBL19305185 0.82 INSR (0.52) SNCAAPPBCHETNFNOD1
SCHEMBL17835477 0.81 SNCA (0.50) SNCAAPPBCHETNFNOD1
SCHEMBL19305184 0.81 INSR (0.53) SNCAAPPBCHETNFNOD1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3034654-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-10-25 EP claimed
US-20170275767-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-28 US claimed
EP-2241653-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-06 EP claimed
EP-3034654-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2016-06-22 EP claimed
US-8758634-B2 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2014-06-24 US claimed
US-20130056438-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2013-03-07 US claimed
WO-2011147448-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2011-12-01 WO claimed
EP-2241653-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2010-10-20 EP claimed
EP-3034654-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-10-25 EP disclosed
US-20170275767-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-28 US disclosed
EP-2241653-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-06 EP disclosed
EP-3034654-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2016-06-22 EP disclosed
US-8758634-B2 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2014-06-24 US disclosed
US-20130056438-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2013-03-07 US disclosed
EP-2241653-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2010-10-20 EP disclosed