SCHEMBL17856965

SCHEMBL17856965

CCn1c2ccc(C(=O)/C(=N/OC(C)=O)c3ccc(C)cc3C)cc2c2cc(C(=O)c3cccs3)ccc21

nearest known ligand 0.38

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MAPT P10636 7/20 0.38
PKM P14618 2/20 0.38
ALDH1A1 P00352 3/20 0.38
MAPK1 P28482 2/20 0.38
KMT2A Q03164 1/20 0.38
POLB P06746 2/20 0.37
HPGD P15428 4/20 0.37
SMN1; SMN2 Q16637 3/20 0.37
NPC1 O15118 4/20 0.36
RAB9A P51151 3/20 0.36
TSHR P16473 1/20 0.36
KDR P35968 1/20 0.36
TEK Q02763 1/20 0.36
KDM4E B2RXH2 2/20 0.35
HTT P42858 1/20 0.35
CNR1 P21554 1/20 0.35
CNR2 P34972 1/20 0.35
LMNA P02545 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17856966 0.92 PKM (0.40) MAPTPKMALDH1A1MAPK1KMT2A
SCHEMBL17856971 0.91 KMT2A (0.44) MAPTPKMALDH1A1MAPK1KMT2A
SCHEMBL17856970 0.91 MAPT (0.37) MAPTPKMALDH1A1MAPK1KMT2A
SCHEMBL17856961 0.86 KDM4E (0.40) MAPTALDH1A1MAPK1KMT2APOLB
SCHEMBL24394483 0.85 HPGD (0.41) MAPTPKMALDH1A1MAPK1KMT2A
SCHEMBL11960272 0.85 HPGD (0.41) MAPTPKMALDH1A1MAPK1KMT2A
SCHEMBL17856969 0.84 PKM (0.43) MAPTPKMALDH1A1MAPK1KMT2A
SCHEMBL16757721 0.84 PKM (0.38) MAPTPKMALDH1A1HPGDSMN1; SMN2
SCHEMBL16757718 0.84 PKM (0.38) MAPTPKMALDH1A1HPGDSMN1; SMN2
SCHEMBL16757679 0.83 PKM (0.39) MAPTPKMALDH1A1POLBHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160178813-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2016-06-23 US disclosed
US-20160178813-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2016-06-23 US disclosed