SCHEMBL17856971

SCHEMBL17856971

CCn1c2ccc(C(=O)/C(=N/OC(=O)c3ccccc3)c3ccc(C)cc3C)cc2c2cc(C(=O)c3cccs3)ccc21

nearest known ligand 0.44

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 3/20 0.44
ALDH1A1 P00352 2/20 0.44
MAPK1 P28482 1/20 0.44
MAPT P10636 6/20 0.43
PKM P14618 5/20 0.43
NPC1 O15118 3/20 0.39
RAB9A P51151 3/20 0.39
SMN1; SMN2 Q16637 3/20 0.39
HPGD P15428 2/20 0.39
POLB P06746 2/20 0.37
L3MBTL1 Q9Y468 1/20 0.36
CDK5 Q00535 1/20 0.36
CDK5R1 Q15078 1/20 0.36
HPGDS O60760 1/20 0.35
KDR P35968 1/20 0.35
TEK Q02763 1/20 0.35
CNR2 P34972 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17856969 0.94 PKM (0.43) KMT2AALDH1A1MAPK1MAPTPKM
SCHEMBL17856968 0.91 KMT2A (0.42) KMT2AALDH1A1MAPK1MAPTPKM
SCHEMBL17856965 0.91 MAPT (0.38) KMT2AALDH1A1MAPK1MAPTPKM
SCHEMBL17856967 0.88 ALDH1A1 (0.39) KMT2AALDH1A1MAPK1MAPTPKM
SCHEMBL18353741 0.85 PKM (0.40) KMT2AALDH1A1MAPK1MAPTPKM
SCHEMBL17856966 0.85 PKM (0.40) KMT2AALDH1A1MAPK1MAPTPKM
SCHEMBL18353740 0.84 CNR2 (0.48) KMT2AALDH1A1MAPK1MAPTPKM
SCHEMBL17856964 0.83 KDM4E (0.41) KMT2AALDH1A1MAPK1MAPTNPC1
SCHEMBL17856970 0.82 MAPT (0.37) KMT2AALDH1A1MAPK1MAPTPKM
SCHEMBL16773865 0.81 ALDH1A1 (0.40) KMT2AALDH1A1MAPK1MAPTPKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160178813-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2016-06-23 US disclosed
US-20160178813-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2016-06-23 US disclosed