SCHEMBL17866337

SCHEMBL17866337

O=C(O)c1nc(-c2ccc(O)cc2)n[nH]1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 2/20 0.47
ALPL P05186 1/20 0.47
MEN1 O00255 3/20 0.43
KMT2A Q03164 3/20 0.43
MAPT P10636 3/20 0.43
RAB9A P51151 2/20 0.43
LMNA P02545 2/20 0.43
SRD5A2 P31213 1/20 0.42
PKM P14618 2/20 0.42
NPC1 O15118 1/20 0.42
USP2 O75604 1/20 0.42
TP53 P04637 1/20 0.42
NFKB1 P19838 1/20 0.42
NFKB2 Q00653 1/20 0.42
RELA Q04206 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
CA1 P00915 1/20 0.42
CA2 P00918 1/20 0.42
CA3 P07451 1/20 0.42
TYR P14679 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23153561 0.84 CA12 (0.49) CA12ALPLMEN1KMT2AMAPT
SCHEMBL13913100 0.75 KMO (0.51) MEN1KMT2AMAPTRAB9ANPC1
SCHEMBL23153538 0.73 SMN1; SMN2 (0.60) MAPTRAB9ALMNANPC1TP53
SCHEMBL9467129 0.73 NR1H2 (0.64) MEN1KMT2AMAPTRAB9ALMNA
SCHEMBL17866346 0.72 ADORA2A (0.51) MEN1KMT2AMAPTRAB9ALMNA
SCHEMBL11575048 0.71 NR1H2 (0.52) ALPLKMT2AMAPTRAB9ALMNA
SCHEMBL17279695 0.71 NR1H2 (0.79) ALPLMEN1KMT2AMAPTRAB9A
SCHEMBL28221056 0.69 NR1H2 (0.63) MEN1KMT2AMAPTRAB9ALMNA
SCHEMBL9815359 0.69 CGAS (0.46) KMT2ALMNACGASAOC3HPGD
SCHEMBL25434687 0.69 AOC3 (0.52) ALPLMAPTRAB9ALMNANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3241075-B1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FUJIFILM ELECTRONIC MAT USA INC (US) 2024-10-16 EP disclosed
US-9914902-B2 Stripping compositions for removing photoresists from semiconductor substrates FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2018-03-13 US disclosed
EP-3241075-A1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FujiFilm Electronic Materials USA, Inc. (US) 2017-11-08 EP disclosed
US-20160186106-A1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-06-30 US disclosed