SCHEMBL17866356

SCHEMBL17866356

CCC(CN(O)O)N(C)O

nearest known ligand 0.37

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
SLC6A4 P31645 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7849355 0.83 SLC6A4 (0.37) SLC6A4
SCHEMBL465472 0.80
SCHEMBL17866363 0.74
SCHEMBL7902976 0.72 ALDH1A1 (0.35)
SCHEMBL17866344 0.67
SCHEMBL9930528 0.65 TSHR (0.35) SLC6A4
SCHEMBL19937888 0.65
SCHEMBL15563050 0.65 LMNA (0.43)
SCHEMBL15563201 0.65 LMNA (0.43)
SCHEMBL15563254 0.65 LMNA (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3241075-B1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FUJIFILM ELECTRONIC MAT USA INC (US) 2024-10-16 EP disclosed
US-9914902-B2 Stripping compositions for removing photoresists from semiconductor substrates FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2018-03-13 US disclosed
EP-3241075-A1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FujiFilm Electronic Materials USA, Inc. (US) 2017-11-08 EP disclosed
US-20160186106-A1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-06-30 US disclosed