SCHEMBL17866362

SCHEMBL17866362

O=C(O)c1n[nH]c(-c2ccccc2O)n1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ADORA2A P29274 1/20 0.59
DCUN1D1 Q96GG9 2/20 0.57
KDM4E B2RXH2 3/20 0.45
HPGD P15428 3/20 0.45
GUSB P08236 1/20 0.45
HSD17B10 Q99714 1/20 0.45
IDO1 P14902 1/20 0.45
MGAM O43451 1/20 0.43
HSP90AA1 P07900 1/20 0.41
HSP90AB1 P08238 1/20 0.41
PDK1 Q15118 1/20 0.41
PDK2 Q15119 1/20 0.41
PDK3 Q15120 1/20 0.41
PDK4 Q16654 1/20 0.41
ALOX15 P16050 2/20 0.41
NR1H2 P55055 1/20 0.41
NR1H3 Q13133 1/20 0.41
LMNA P02545 1/20 0.40
CYP1A2 P05177 1/20 0.40
CYP3A4 P08684 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1528343 0.75 ADORA2A (0.77) ADORA2ADCUN1D1KDM4EHPGDGUSB
SCHEMBL1528413 0.75 ADORA2A (1.00) ADORA2ADCUN1D1HPGDHSD17B10MGAM
SCHEMBL17866359 0.72 CA12 (0.47) ADORA2AHPGDGUSBLMNACYP1A2
SCHEMBL6449793 0.70 ADORA2A (0.69) ADORA2ADCUN1D1KDM4EHPGDHSD17B10
SCHEMBL17866346 0.70 ADORA2A (0.51) ADORA2ADCUN1D1KDM4EHPGDIDO1
SCHEMBL15312405 0.69 F2 (0.52) HPGDLMNACYP1A2CYP3A4CYP2D6
SCHEMBL12171144 0.68 ADORA2A (0.59) ADORA2AKDM4EHPGDHSD17B10ALOX15
SCHEMBL6748168 0.68 BTK (0.55) ADORA2ADCUN1D1KDM4EHPGDGUSB
SCHEMBL6560810 0.68 ADORA2A (0.76) ADORA2ADCUN1D1KDM4EHPGDHSD17B10
SCHEMBL1222694 0.68 ALOX15 (0.61) KDM4EHPGDHSD17B10IDO1ALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3241075-B1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FUJIFILM ELECTRONIC MAT USA INC (US) 2024-10-16 EP disclosed
CN-107850859-B Stripping composition for removing photoresist on semiconductor substrate 富士胶片电子材料美国有限公司 2021-06-01 CN disclosed
CN-107850859-A Stripping composition for removing photoresist on semiconductor substrate 富士胶片电子材料美国有限公司 2018-03-27 CN disclosed
US-9914902-B2 Stripping compositions for removing photoresists from semiconductor substrates FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2018-03-13 US disclosed
EP-3241075-A1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FujiFilm Electronic Materials USA, Inc. (US) 2017-11-08 EP disclosed
US-20160186106-A1 STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-06-30 US disclosed