Isophthalic Acid

Isophthalic Acid

SCHEMBL1801282

CC(O)CO.O=C(O)c1cccc(C(=O)O)c1

nearest known ligand 0.57

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

SLC5A2

The experimentally established mechanism targets of Isophthalic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 1/20 0.50
CA1 P00915 1/20 0.50
CA2 P00918 1/20 0.50
CA6 P23280 1/20 0.50
CA9 Q16790 1/20 0.50
FOLH1 Q04609 1/20 0.48
ANPEP P15144 1/20 0.47
ENPEP Q07075 1/20 0.47
TP53 P04637 1/20 0.47
HSD17B10 Q99714 2/20 0.47
KMO O15229 1/20 0.47
CYP1A2 P05177 1/20 0.47
CYP2C9 P11712 1/20 0.47
HPGD P15428 1/20 0.47
MEP1B Q16820 2/20 0.46
KMT2A Q03164 2/20 0.46
GAA P10253 1/20 0.46
UNG P13051 1/20 0.46
MRGPRX4 Q96LA9 1/20 0.45
DAO P14920 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Isophthalic Acid SCHEMBL9856502 1.00 CA12 (0.50) CA12CA1CA2CA6CA9
Isophthalic Acid SCHEMBL28960768 0.96 CA12 (0.47) CA12CA1CA2CA6CA9
Isophthalic Acid SCHEMBL11132241 0.91 UNG (0.43) CA12CA1CA2CA6CA9
Propylene Glycol SCHEMBL31734112 0.91 ATM (0.60) CA1CA2CA9HSD17B10HPGD
Isophthalic Acid SCHEMBL11132245 0.91 UNG (0.43) CA12CA1CA2CA6CA9
Isophthalic Acid SCHEMBL31359378 0.90 HDAC3 (0.46) CA12CA1CA2CA6CA9
Propylene Glycol SCHEMBL28663698 0.88 CYP4F2 (0.53) FOLH1HSD17B10HPGDMEP1BTSHR
Isophthalic Acid SCHEMBL9133851 0.88 CA12 (0.50) CA12CA1CA2CA6CA9
Propylene Glycol SCHEMBL5079139 0.88 NPC1 (0.50) HPGDKMT2A
Benzoic Acid SCHEMBL524377 0.88 TSHR (0.61) TP53HPGDKMT2ADAOTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111021636-B Waterproof encaustic tile for metal roof of factory building and repair method for metal roof of factory building 武汉易知鸟科技有限公司 2025-04-04 CN claimed
CN-111021636-A Waterproof encaustic tile for metal roof of factory building and repairing method for metal roof of factory building 天津滨联科技发展有限公司 2020-04-17 CN claimed
US-6048598-A Composite reinforcing member BALABA CONCRETE SUPPLY, INC. (US) 2000-04-11 US claimed
CN-111021636-B Waterproof encaustic tile for metal roof of factory building and repair method for metal roof of factory building 武汉易知鸟科技有限公司 2025-04-04 CN disclosed
CN-118406422-B Fireproof flame-retardant composite material plate and preparation method thereof 苏州多凯复合材料有限公司 2024-11-05 CN disclosed
CN-118406422-A Fireproof flame-retardant composite material plate and preparation method thereof 苏州多凯复合材料有限公司 2024-07-30 CN disclosed
WO-2023173791-A1 POLYESTER MATERIAL AND POLYESTER PRODUCT, AND PREPARATION METHODS THEREFOR AND USE THEREOF 中国科学院宁波材料技术与工程研究所 2023-09-21 WO disclosed
CN-113232397-A Recyclable packaging material and preparation method thereof 浙江诚信包装有限公司 2021-08-10 CN disclosed
CN-112537104-A Composite structure daylighting panel and preparation method thereof 南京乔威复合材料有限公司 2021-03-23 CN disclosed
CN-112092477-A Improved daylighting panel and preparation method thereof 苏州多凯复合材料有限公司 2020-12-18 CN disclosed
CN-111021636-A Waterproof encaustic tile for metal roof of factory building and repairing method for metal roof of factory building 天津滨联科技发展有限公司 2020-04-17 CN disclosed
US-6040391-A Process for thickening thermoset resin molding compound compositions PREMIX, INC. (US) 2000-03-21 US disclosed
US-5854317-A Process for thickening thermoset resin molding compound compositions PREMIX, INC. (US) 1998-12-29 US disclosed
EP-0877763-A1 PROCESS FOR THICKENING THERMOSET RESIN MOLDING COMPOUND COMPOSITIONS PREMIX, INC. (US) 1998-11-18 EP disclosed
WO-1997028196-A1 PROCESS FOR THICKENING THERMOSET RESIN MOLDING COMPOUND COMPOSITIONS PREMIX, INC. (US) 1997-08-07 WO disclosed
EP-0361823-B1 A process for forming a composite structure of thermoplastic polymer and sheet molding compound DU PONT (US) 1995-02-15 EP disclosed
EP-0324040-B1 PROCESS FOR CONTROLLING MONOMERIC EMISSIONS BASF Aktiengesellschaft (DE) 1992-07-08 EP disclosed
US-5001000-A Multilayer thermoplastic composite sheets of polyacrylate polymer bonded to thermosetting resin layer of polyester with filler pigment and glass fibers E. I. DU PONT DE NEMOURS AND COMPANY (US) 1991-03-19 US disclosed
US-4959189-A AUTOMOBILE, VEHICLE PARTS E. I. DU PONT DE NEMOURS AND COMPANY (US) 1990-09-25 US disclosed
EP-0361823-A2 A process for forming a composite structure of thermoplastic polymer and sheet molding compound E.I. DU PONT DE NEMOURS AND COMPANY (US) 1990-04-04 EP disclosed