SCHEMBL18068601

SCHEMBL18068601

C=C(C)C(=O)OC1(C2CCCC2)CCCCC(C)C1

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18068602 0.99 CYP1A2 (0.33) CYP1A2
SCHEMBL18068590 0.97 CYP1A2 (0.33) CYP1A2
SCHEMBL18068517 0.93 CYP1A2 (0.31) CYP1A2
SCHEMBL18068508 0.91 CYP1A2 (0.30) CYP1A2
SCHEMBL18068615 0.89 ALDH1A1 (0.31)
SCHEMBL18068620 0.88 EPHX1 (0.31)
SCHEMBL954627 0.88 ALDH1A1 (0.34) CYP1A2
SCHEMBL9893522 0.88 ALDH1A1 (0.34) CYP1A2
SCHEMBL18068533 0.86 ALDH1A1 (0.31)
SCHEMBL7920362 0.86 ALDH1A1 (0.33) CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9841679-B2 Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2017-12-12 US disclosed
US-9841679-B2 Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2017-12-12 US disclosed
US-20160266488-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2016-09-15 US disclosed
US-20160266488-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2016-09-15 US disclosed