SCHEMBL18094545

SCHEMBL18094545

CCCCCCCCCCCCC(N)(N)C(N)CCCCCCCCN

nearest known ligand 0.48

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 8/20 0.48
MEN1 O00255 1/20 0.48
KMT2A Q03164 1/20 0.48
ALDH1A1 P00352 1/20 0.48
TSHR P16473 1/20 0.48
EPHX1 P07099 1/20 0.48
GNAI3 P08754 1/20 0.41
GNAO1 P09471 1/20 0.41
GNAI1 P63096 1/20 0.41
SPHK1 Q9NYA1 1/20 0.41
SMPD1 P17405 2/20 0.39
FDPS P14324 2/20 0.39
OPRM1 P35372 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11524753 1.00 DNM1 (0.48) DNM1MEN1KMT2AALDH1A1TSHR
SCHEMBL7596753 1.00 DNM1 (0.48) DNM1MEN1KMT2AALDH1A1TSHR
SCHEMBL14894954 0.92 DNM1 (0.41) DNM1MEN1KMT2AALDH1A1TSHR
SCHEMBL7611818 0.85 DNM1 (0.48) DNM1MEN1KMT2AALDH1A1TSHR
SCHEMBL29153565 0.84 OPRM1 (0.44) SPHK1OPRM1
SCHEMBL2516506 0.80 DNM1 (0.33) DNM1MEN1KMT2AALDH1A1TSHR
SCHEMBL29153559 0.78 OPRM1 (0.46) SPHK1OPRM1
SCHEMBL21627258 0.78 OPRM1 (0.46) SPHK1OPRM1
SCHEMBL15520215 0.78 DNM1 (0.48) DNM1MEN1KMT2AALDH1A1TSHR
SCHEMBL23407456 0.76 OPRM1 (0.44) SPHK1SMPD1FDPSOPRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3075757-B1 POLYAMIDE RESIN AND POLYAMIDE MOLDED BODY USING SAME LOTTE ADVANCED MAT CO LTD (KR) 2020-04-01 EP disclosed
US-9796814-B2 Polyamide resin and polyamide molded body using same LOTTE ADVANCED MATERIALS CO., LTD. (KR) 2017-10-24 US disclosed
EP-3075757-A1 POLYAMIDE RESIN AND POLYAMIDE MOLDED BODY USING SAME Samsung SDI Co., Ltd. (KR) 2016-10-05 EP disclosed
US-20160280855-A1 Polyamide Resin and Polyamide Molded Body Using Same LOTTE ADVANCED MATERIALS CO., LTD. (KR) 2016-09-29 US disclosed