⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23552858 | 0.90 | — | — | |
| SCHEMBL18123034 | 0.90 | — | — | |
| SCHEMBL23552876 | 0.86 | KMT2A (0.33) | — | |
| SCHEMBL18123004 | 0.84 | CNR2 (0.41) | — | |
| SCHEMBL17877629 | 0.84 | MAP2 (0.34) | — | |
| SCHEMBL18933437 | 0.84 | NPC1 (0.34) | — | |
| SCHEMBL18122991 | 0.83 | PDK2 (0.42) | — | |
| SCHEMBL23080093 | 0.83 | — | — | |
| SCHEMBL17056217 | 0.81 | NPC1 (0.44) | — | |
| SCHEMBL18218064 | 0.81 | NPC1 (0.44) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240239922-A1 | PHOTOCURABLE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-07-18 | — | — | US | disclosed |
| US-20240239922-A1 | PHOTOCURABLE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-07-18 | — | — | US | disclosed |
| US-20230242692-A1 | COMPOSITION AND CURED PRODUCT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-03 | — | — | US | disclosed |
| WO-2023127402-A1 | PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM | 東京応化工業株式会社 | 2023-07-06 | — | — | WO | disclosed |
| WO-2023127401-A1 | PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM | 東京応化工業株式会社 | 2023-07-06 | — | — | WO | disclosed |
| WO-2023120077-A1 | COMPOSITION, AND PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-06-29 | — | — | WO | disclosed |
| WO-2023120076-A1 | PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-06-29 | — | — | WO | disclosed |
| WO-2023074266-A1 | PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023074264-A1 | PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023047856-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-03-30 | — | — | WO | disclosed |
| US-20180113383-A1 | COLORING AGENT DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL ELEMENT, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-04-26 | — | — | US | disclosed |
| US-20180113383-A1 | COLORING AGENT DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL ELEMENT, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-04-26 | — | — | US | disclosed |
| US-20180107114-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM | TOKYO OHKA KOGYO CO LTD (JP) | 2018-04-19 | — | — | US | disclosed |
| US-20180107114-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM | TOKYO OHKA KOGYO CO LTD (JP) | 2018-04-19 | — | — | US | disclosed |
| US-20180086717-A1 | HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-03-29 | — | — | US | disclosed |
| US-20180086717-A1 | HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-03-29 | — | — | US | disclosed |
| US-20170160636-A1 | PHOTOSENSITIVE COMPOSITION AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-06-08 | — | — | US | disclosed |
| US-20170160636-A1 | PHOTOSENSITIVE COMPOSITION AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-06-08 | — | — | US | disclosed |
| WO-2017007010-A1 | SILICON-CONTAINING RESIN COMPOSITION | 東京応化工業株式会社 | 2017-01-12 | — | — | WO | disclosed |
| WO-2016158679-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | 東京応化工業株式会社 | 2016-10-06 | — | — | WO | disclosed |