SCHEMBL23552858

SCHEMBL23552858

CCCC1(CCC)c2cc(/C(=N\OC(C)=O)c3ccccc3C)ccc2-c2c1cc(C(=O)c1ccoc1)c1ccccc21

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18123019 0.90 — —
SCHEMBL23552638 0.86 CDC25B (0.37) —
SCHEMBL23552879 0.86 MEN1 (0.30) —
SCHEMBL23552870 0.84 PKM (0.37) —
SCHEMBL23552648 0.83 NPC1 (0.32) —
SCHEMBL18123034 0.81 — —
SCHEMBL18123004 0.80 CNR2 (0.41) —
SCHEMBL23552876 0.78 KMT2A (0.33) —
SCHEMBL18933437 0.78 NPC1 (0.34) —
SCHEMBL17877629 0.78 MAP2 (0.34) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210191264-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND ORGANIC EL DISPLAY AND MANUFACTURING METHOD THEREFOR TORAY INDUSTRIES, INC. (JP) 2021-06-24 — — US disclosed
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