Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CNR2 | P34972 | 17/20 | 0.41 |
| ▸ | CDC25B | P30305 | 1/20 | 0.38 |
| ▸ | NPC1 | O15118 | 1/20 | 0.36 |
| ▸ | RAB9A | P51151 | 1/20 | 0.36 |
| ▸ | CNR1 | P21554 | 5/20 | 0.35 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.34 |
| ▸ | HPGD | P15428 | 1/20 | 0.34 |
| ▸ | TSHR | P16473 | 1/20 | 0.34 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.34 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.34 |
| ▸ | NR1H4 | Q96RI1 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23552638 | 0.91 | CDC25B (0.37) | CNR2CDC25BNPC1RAB9ACNR1 | |
| SCHEMBL18122999 | 0.91 | CNR2 (0.41) | CNR2CDC25BNPC1RAB9ACNR1 | |
| SCHEMBL23553033 | 0.90 | CNR2 (0.35) | CNR2CDC25BNPC1RAB9AMEN1 | |
| SCHEMBL17056199 | 0.89 | CNR2 (0.39) | CNR2CDC25BCNR1CYP2C9 | |
| SCHEMBL17084343 | 0.88 | NPC1 (0.36) | CNR2CDC25BNPC1RAB9ACNR1 | |
| SCHEMBL23552876 | 0.87 | KMT2A (0.33) | NPC1RAB9AMEN1HPGDKMT2A | |
| SCHEMBL17877629 | 0.85 | MAP2 (0.34) | NPC1RAB9AMEN1ALDH1A1MAPT | |
| SCHEMBL18933437 | 0.85 | NPC1 (0.34) | NPC1RAB9AALDH1A1MAPTHPGD | |
| SCHEMBL18122991 | 0.84 | PDK2 (0.42) | NPC1RAB9ACYP2C9ALDH1A1CYP1A2 | |
| SCHEMBL18123019 | 0.84 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240239922-A1 | PHOTOCURABLE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-07-18 | — | — | US | disclosed |
| US-20240239922-A1 | PHOTOCURABLE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-07-18 | — | — | US | disclosed |
| US-20230242692-A1 | COMPOSITION AND CURED PRODUCT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-03 | — | — | US | disclosed |
| US-20230242692-A1 | COMPOSITION AND CURED PRODUCT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-03 | — | — | US | disclosed |
| WO-2023127402-A1 | PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM | 東京応化工業株式会社 | 2023-07-06 | — | — | WO | disclosed |
| WO-2023127401-A1 | PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM | 東京応化工業株式会社 | 2023-07-06 | — | — | WO | disclosed |
| WO-2023120077-A1 | COMPOSITION, AND PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-06-29 | — | — | WO | disclosed |
| WO-2023120076-A1 | PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-06-29 | — | — | WO | disclosed |
| WO-2023074266-A1 | PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023074264-A1 | PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-05-04 | — | — | WO | disclosed |
| US-20180113383-A1 | COLORING AGENT DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL ELEMENT, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-04-26 | — | — | US | disclosed |
| US-20180113383-A1 | COLORING AGENT DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL ELEMENT, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-04-26 | — | — | US | disclosed |
| US-20180107114-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM | TOKYO OHKA KOGYO CO LTD (JP) | 2018-04-19 | — | — | US | disclosed |
| US-20180107114-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM | TOKYO OHKA KOGYO CO LTD (JP) | 2018-04-19 | — | — | US | disclosed |
| US-20180086717-A1 | HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-03-29 | — | — | US | disclosed |
| US-20180086717-A1 | HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-03-29 | — | — | US | disclosed |
| US-20170160636-A1 | PHOTOSENSITIVE COMPOSITION AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-06-08 | — | — | US | disclosed |
| US-20170160636-A1 | PHOTOSENSITIVE COMPOSITION AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-06-08 | — | — | US | disclosed |
| WO-2017007010-A1 | SILICON-CONTAINING RESIN COMPOSITION | 東京応化工業株式会社 | 2017-01-12 | — | — | WO | disclosed |
| WO-2016158679-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | 東京応化工業株式会社 | 2016-10-06 | — | — | WO | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20180107114-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYAMIDE RESIN, METHOD FOR PRODUCING POLYAMIDE RESIN, COMPOUND, METHOD FOR PRODUCING COMPOUND, METHOD FOR PRODUCING CURED FILM, AND CURED FILM | RARA, LCP1, CUTA | CNR2 1552/4885CDC25B 4705/4885NPC1 2823/4885 |
| US-20180086717-A1 | HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT | SLC9A2, SLC9A1, NHERF1 | CNR2 4716/4885CDC25B 3188/4885NPC1 2457/4885 |
| US-20170160636-A1 | PHOTOSENSITIVE COMPOSITION AND COMPOUND | C1R, CRY1, C1S | CNR2 1361/4885CDC25B 865/4885NPC1 1861/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.