SCHEMBL1823095

SCHEMBL1823095

CCCc1cc(/C=C/c2cc(C(C)(C)C)c(O)cc2C)cc(C)c1O

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 3/20 0.40
TP53 P04637 2/20 0.40
CYP2D6 P10635 1/20 0.40
CYP2C9 P11712 1/20 0.40
CYP2C19 P33261 1/20 0.40
PTGS1 P23219 13/20 0.40
PTGS2 P35354 13/20 0.40
ALOX5 P09917 7/20 0.40
ALDH1A1 P00352 2/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
CYP3A4 P08684 1/20 0.36
TSHR P16473 1/20 0.36
MAPK1 P28482 1/20 0.36
HIF1A Q16665 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
KDM4E B2RXH2 1/20 0.34
CYP1A2 P05177 1/20 0.34
MAPT P10636 1/20 0.34
ATP2A2 P16615 1/20 0.34
ATP2A3 Q93084 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1823099 1.00 ALOX15 (0.40) ALOX15TP53CYP2D6CYP2C9CYP2C19
SCHEMBL1823109 0.85 PTGS1 (0.53) ALOX15TP53CYP2D6CYP2C9PTGS1
SCHEMBL1823108 0.85 PTGS1 (0.53) ALOX15TP53CYP2D6CYP2C9PTGS1
SCHEMBL1823151 0.84 PTGS1 (0.49) CYP2C9CYP2C19PTGS1PTGS2ALOX5
SCHEMBL1823153 0.84 PTGS1 (0.49) CYP2C9CYP2C19PTGS1PTGS2ALOX5
SCHEMBL1820980 0.78 ALOX15 (0.56) ALOX15TP53CYP2D6CYP2C9CYP2C19
SCHEMBL1820982 0.78 ALOX15 (0.56) ALOX15TP53CYP2D6CYP2C9CYP2C19
SCHEMBL1823505 0.76 PTGS1 (0.50) PTGS1PTGS2ALOX5
SCHEMBL1823507 0.76 PTGS1 (0.50) PTGS1PTGS2ALOX5
SCHEMBL1823576 0.74 PTGS1 (0.43) ALOX15TP53CYP2D6CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110163461-A1 ELECTRONIC PACKAGING EVONIK DEGUSSA GMBH (DE) 2011-07-07 US claimed
US-5939509-A Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1999-08-17 US claimed
US-5939473-A Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-08-17 US claimed
US-20110163461-A1 ELECTRONIC PACKAGING EVONIK DEGUSSA GMBH (DE) 2011-07-07 US disclosed
EP-2119737-B1 Electronic packaging EVONIK DEGUSSA GMBH (DE) 2011-05-04 EP disclosed
EP-2119737-A1 Electronic packaging Evonik Degussa GmbH (DE) 2009-11-18 EP disclosed
EP-0869140-B1 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL CO (JP) 2003-08-13 EP disclosed
US-6190786-B1 BIS(GLYCIDYLOXY)STILBENE RESINS SUMITOMO CHEMICAL COMPANY, LTD. (JP) 2001-02-20 US disclosed
US-5939509-A Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1999-08-17 US disclosed
US-5939473-A Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-08-17 US disclosed
EP-0739877-B1 Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL CO (JP) 1999-08-04 EP disclosed
EP-0869140-A2 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-10-07 EP disclosed
EP-0739877-A2 Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY LIMITED (JP) 1996-10-30 EP disclosed