SCHEMBL1823151

SCHEMBL1823151

CCCc1cc(/C=C/c2cc(C)c(O)c(C(C)(C)C)c2)cc(C)c1O

nearest known ligand 0.52

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 10/20 0.49
PTGS2 P35354 10/20 0.49
CYP1A2 P05177 1/20 0.45
CYP2C9 P11712 1/20 0.45
CYP2C19 P33261 1/20 0.45
GABBR2 O75899 2/20 0.43
GABBR1 Q9UBS5 2/20 0.43
ALOX5 P09917 6/20 0.42
TTR P02766 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1823153 1.00 PTGS1 (0.49) PTGS1PTGS2CYP1A2CYP2C9CYP2C19
SCHEMBL1823507 0.85 PTGS1 (0.50) PTGS1PTGS2GABBR2GABBR1ALOX5
SCHEMBL1823505 0.85 PTGS1 (0.50) PTGS1PTGS2GABBR2GABBR1ALOX5
SCHEMBL1823095 0.84 ALOX15 (0.40) PTGS1PTGS2CYP1A2CYP2C9CYP2C19
SCHEMBL1823099 0.84 ALOX15 (0.40) PTGS1PTGS2CYP1A2CYP2C9CYP2C19
SCHEMBL1823689 0.84 PTGS1 (0.65) PTGS1PTGS2CYP1A2CYP2C9CYP2C19
SCHEMBL1823687 0.84 PTGS1 (0.65) PTGS1PTGS2CYP1A2CYP2C9CYP2C19
SCHEMBL1825661 0.82 PTGS1 (0.62) PTGS1PTGS2CYP1A2CYP2C9CYP2C19
SCHEMBL1825659 0.82 PTGS1 (0.62) PTGS1PTGS2CYP1A2CYP2C9CYP2C19
SCHEMBL1823278 0.78 PTGS1 (0.48) PTGS1PTGS2GABBR2GABBR1ALOX5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110163461-A1 ELECTRONIC PACKAGING EVONIK DEGUSSA GMBH (DE) 2011-07-07 US claimed
US-5939509-A Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1999-08-17 US claimed
US-5939473-A Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-08-17 US claimed
US-20110163461-A1 ELECTRONIC PACKAGING EVONIK DEGUSSA GMBH (DE) 2011-07-07 US disclosed
EP-2119737-B1 Electronic packaging EVONIK DEGUSSA GMBH (DE) 2011-05-04 EP disclosed
EP-2119737-A1 Electronic packaging Evonik Degussa GmbH (DE) 2009-11-18 EP disclosed
EP-0869140-B1 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL CO (JP) 2003-08-13 EP disclosed
US-6190786-B1 BIS(GLYCIDYLOXY)STILBENE RESINS SUMITOMO CHEMICAL COMPANY, LTD. (JP) 2001-02-20 US disclosed
US-5939509-A Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1999-08-17 US disclosed
US-5939473-A Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-08-17 US disclosed
EP-0739877-B1 Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL CO (JP) 1999-08-04 EP disclosed
EP-0869140-A2 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-10-07 EP disclosed
EP-0739877-A2 Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY LIMITED (JP) 1996-10-30 EP disclosed